New RAM Modules Ballistix Sport SODIMM from Lexar Media



Lexar Media, a well-known American designer of diverse digital media products, starts selling its new RAM series from Ballistix line. Entitled Sport SODIMM, the series is introduced by four SODIMM-DDR3 modules, intended for the incorporation into gaming laptops: BLS4G3N169ES4, BLS8G3N169ES4, BLS4G3N18AES4, and BLS8G3N18AES4. The quadruple is distinguished by an original design with the implementation of unique heatspreaders. All of them are optimized for Intel Core i5/i7 mobile processors of the fourth generation (Intel Haswell platform) and support all up-dated XMP profiles.


The most beneficial feature applied to Ballistix Sport SODIMM modules is their power-saving nature. They are able to operate at 10% lower power voltage than analogous products; hence, they reduce the laptop’s power consumption index and increase the time of its offline work.


To continue, the first two models, BLS4G3N169ES4 and BLS8G3N169ES4, come in 4 GB and 8 GB capacities correspondingly. They …

Meeting New Chassis Sugo SG10 from SilverStone

SilverStone Technology, a celebrated Taiwanese PC hardware manufacturer, is going to release at the end of the current month its new mini-tower chassis codenamed SG10 that joined the SilverStone Sugo series. Featuring 354x295x220 mm dimensions, the novice is housed in a case made of stainless steel (totally black exterior and interior) with an aluminum frontal facet. The latter comprises a ventilation slot, covered by an anti-dust grid.



First of all, it should be noted that Sugo SG10 is predestined specifically for the assembling of small-sized but rather high-performance PC systems. The chassis is compatible with motherboards of mini-ITX/micro-ATX standard and is ready to welcome graphics adapters of up to 338 mm (length), PSUs of 180 mm (length), as well as CPU coolers of up to 165 mm (height). One of its key peculiarities is the localization of the power supply unit at the frontal part of the case, if compared with the majority of contemporary solutions with PSU bays at the …

Xigmatek Intros New CPU Cooler Gaia II

Xigmatek, an outstanding manufacturer of cutting-edge PC components, announces the release of a new CPU cooler, entitled Gaia II. The model is developed in accordance with a traditional tower-like framework and might be truly called a universal cooling solution. It supports a large variety of platforms for processors with TDP level of not higher than 150 W: Intel Socket LGA 775/1366/1156 and AMD Socket AM2(+)/AM3(+)/FM2/FM1.



Cooler Gaia II is designed with the direct implementation of H.D.T. technology (Heat Pipe Direct Touch). This implies that all three copper heatpipes, which stem from the heatsink base, come into direct contact with the CPU surface. The heatpipes themselves have got U-shape structure and 8 mm dimensions. They pierce ‘multi-plate’ aluminum heatsink to provide for a better heat dissipation.


The model is delivered with a pre-installed 120 mm fan with bright orange blades; it is fixed to one of the heatsink sides and housed in a black frame. The fan is …
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Registered at: 04 April 2011, 22:11
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