The First Take on Versa N23 Chassis from Thermaltake

Thermaltake PC cases have never been a frustration. The Versa N23 is not an exception. It is a combination of functionality balanced with modern styling and a bit of company’s passion. The middle-tower chassis draws attention by the front panel with light-blue insertions against black panel. The other attraction is the right-side panel with an integrated acrylic window.



Thermaltake Versa N23 is intended to accommodate mini-ITX, micro-ATX and ATX motherboards with the maximum of 7 expansion slots. The availability of ODD bays enables the installation of two 5.25-inch drives. The layout also welcomes five 3.5-/2.5-inch drives which might be mounted without any tools.


Internal space is enough for 160-mm high CPU coolers, PS/2 ATX power supply units and 250-mm long graphics cards. If retrieving unnecessary drive bays from the bottom section, there is a chance to install 360-mm long videocards.


To continue, air cooling configuration offers 5 seats for 120 mm fans (2x …

Gaming Enclosure Chieftec LF-01B Review

Chieftec Industrial Co. Ltd., a global supplier of PC chassis and versatile power supply units, has replenished its line of enclosures with a new series, codenamed Libra. Chieftec LF-01B is a worthy representative of this series, targeting primarily gamers and enthusiasts. The manufacturer equipped the product with branded fixture for voluminous graphics cards to imply its gaming predestination. Besides, this model features high-quality layout to provide for functionality and versatility.



General Peculiarities


Enclosure Chieftec LF-01B is developed in Midi-Tower form factor and goes with the bottom-like PSU localization. There are no color variations of the casing, as it is delivered in totally black coverage. This model is compatible with the motherboards of up to ATX standards and with rather long graphics cards (up to 428 mm in length). Chieftec LF-01B accommodates two HDD bays, one of which is located in the bottom part of the casing; it is intended at a single 2.5-inch …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 06 March 2012, 18:43
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