The Tempered Glass Edition of the Thermaltake Core X71 Chassis

The Thermaltake Company has announced a new Core X71 version of chassis. This solution is called Tempered Glass Edition and is produced in black colour.



One of the novelty’s panels possesses a window out of 4 mm tempered glass instead of the formerly used acrylic panel.


Due to its dual-chamber structure the chassis has much of the inner space, which allows to assemble a PC of almost any complexity with the liquid cooling system utilization.

Motherboards of Mini ITX, Micro ATX and ATX typical sizes can be installed. The maximum number of expansion cards is eight. One can use discrete graphics accelerators of up to 420 mm length.


In the front part of this product, there is enough room to mount a 480 mm heatsink, and it’s possible to install a 360 mm heat dissipator at the top. The preassembled power supply unit length equals to 220 mm.


The dimensions of this full tower chassis by Thermaltake are the following: 677 × 250 × 511 mm.


Unfortunately, the …

Motherboard MSI Z77 MPower Review

The release of motherboards from MSI has always been accompanied by some boom. Either it's a new technological approach or a catching design that draws clients, but MSI managed to make its products a desirable acquirement. A new motherboard MSI Z77 MPower is not an exclusion. The manufacturer enlivens into the product all its developments which could be interesting for the most demanding enthusiasts and devotees of utmost frequencies.



Design and Delivery Set


The implementation of black color scheme into Z77 MPower design is a signifier of a high-end product. Black coloring has been given not only to the printed circuit board but also to the integrated sockets and outputs. PCB is characterized by dull coverage. The intensification of visual effects is achieved by gray and metallic components of the cooling system, as well as bright yellow stripes on the radiator plates. Such color combination adds refinement to the standard appearance of the motherboard.


The nominal …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 26 September 2012, 09:24
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