GeIL Introduces Memory Module Series Evo Leggera

GeIL has lately introduced a new series of memory modules, codenamed Evo Leggera. According to the words of the manufacturers, this series is ready to demonstrate the utmost performance in combination with the low-profile VELOCE radiators which cannot stop the users from installing huge CPU coolers. Evo Leggera represents an optimal solution and improved functionality in one product. The series includes modules of 1333 MHz to 2800 MHz frequencies compiled in two- and four-channel kits.



Evo Leggera is equipped with advanced low-profile heat dispensers 'Leggera' developed with the implementation of Maximum Thermal Conduction and Dissipation technology. This technology ensures efficient cooling activity with the standard module heights. Memory modules Evo Leggera are compatible practically with all newest logics kits, involving Intel Z77 platform. This expands the versatility of the series.


To continue, it should be mentioned that all models in the series have undergone tough …

Xigmatek Intros New CPU Cooler Gaia II

Xigmatek, an outstanding manufacturer of cutting-edge PC components, announces the release of a new CPU cooler, entitled Gaia II. The model is developed in accordance with a traditional tower-like framework and might be truly called a universal cooling solution. It supports a large variety of platforms for processors with TDP level of not higher than 150 W: Intel Socket LGA 775/1366/1156 and AMD Socket AM2(+)/AM3(+)/FM2/FM1.



Cooler Gaia II is designed with the direct implementation of H.D.T. technology (Heat Pipe Direct Touch). This implies that all three copper heatpipes, which stem from the heatsink base, come into direct contact with the CPU surface. The heatpipes themselves have got U-shape structure and 8 mm dimensions. They pierce ‘multi-plate’ aluminum heatsink to provide for a better heat dissipation.


The model is delivered with a pre-installed 120 mm fan with bright orange blades; it is fixed to one of the heatsink sides and housed in a black frame. The fan is …

Zalman Introduces Highly Efficient FX70 Passive Cooler

Zalman, a renowned South Korean designer of various hardware solutions, has recently introduced its latest CPU passive cooler, entitled FX70. The new-entry features 110x140x158 mm dimensions and comes without any fans. However, if there is a need to cool down CPUs with the TDP level higher than 80 W, the customer is free to enhance the facilities by adding two 120 mm fans. The latter are fixed to the heatsink by means of four brackets.



Zalman FX70 is an optimal choice for the following platforms: Intel LGA 2011/1366/115x/775 and AMD FM2/FM1/AM2/AM2+/AM3/AM3+. This cooler fits in any mid-tower ATX and larger PC chassis. The cooler’s framework consists of a copper base, pierced by six nickel-plated heatpipes, and of fifteen heatsink plates with an offbeat design, codenamed Twist; they are called to dramatically improve the process of heat management.


Fanless framework is regarded to be an advantage due to three reasons. First of all, pure heatsink provides absolutely no …
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Registered at: 03 July 2011, 17:27
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