Flash-Drive Adata Nobility S805 16 GB Review

Flash-drives with USB 3.0 interface are masterfully gaining acknowledgement not only among enthusiasts but also among typical consumers. In spite of such tendency, drives with USB 2.0 interface still enjoy popularity due to their comprehensive facilities. In the majority of cases technical specifications influence the customers' choice of the drive; but the multiplicity of models from hundreds of suppliers triggered the tendency of choosing the drives with unique and catching design. Indeed, present-day market is represented by flash-drives of various shapes and colors to satisfy the rising demands of consumers. Adata usually meets the desires of its customers and introduces quite unique drive solutions. Nobility S805 is not an exception and offers both technical and aesthetic satisfaction of customer requirements.


The chief distinctive design feature of Adata Nobility S805 is the availability of a latch hook. It is called to attract the potential consumers and make …

HIS Adds an Original Graphics Card to Its Inventory

The inventory of graphics solutions developed by HIS has been replenished with a new original in design card based on Radeon HD 7850 adapter. Entitled HIS Radeon HD 7850 iPower IceQ, the card is stuffed with a three-slot IceQ cooler and substantial memory volume that equals to 4GB. In addition, this model supports iTurbo applet that promotes for the GPU and memory clock frequencies increase.

Graphics card from HIS is based on a two-layer copper printed circuit board. The latter houses soldered DrMOS elements instead of conventional transistors. The integrated GPU is furnished with 1024 current processors. Its nominal clock frequency equals to 860MHz but can be dynamically boosted due to iTurbo technology. In its turn, iPower technology ensures stability and more voltage index for efficient overclocking process.

Memory subsystem is introduced by GDDR5 modules with 265-bit interface. The nominal memory clock frequency approximates 4800MHz. Power supply subsystem consists of …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 26 June 2011, 14:44
Last visit: 28 June 2011, 10:23