Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …

Release of Low-Profile Cooler Slim Silence A-Plus from Gelid

Gelid Solutions, a Hong-Kong based renowned manufacturer of thermal solutions and other PC hardware, has lately presented its low-profile CPU cooler, codenamed Slim Silence A-Plus, for AMD platform. The new cooler is compatible with AMD AM2(+), AM3(+), as well as, FM1. According to the words of the Asian manufacturer, this model is capable to manage processors with the TDP index fluctuating in the measures of 95W.

There is one peculiar feature about Slim Silence A-Plus: its design resembles the design of coolers destined for GPU due to the foveate fan. That is why, customers can sometimes confuse this cooler's destination.

CPU cooler Slim Silence A-Plus goes in rather compact dimensions; its height does not exceed 28 mm, while its weight equals to 282 g. Such compactness provides for its unimpeded installation into chassis of different form-factor, starting from Mid-Tower, and finishing with Mini-ATX, 1U and HTPC.

The cooler's casing consists of an aluminum radiator …

Intel Debuts with 5th Gen Core Mobile CPUs

Within the confines of CES 2015, Intel has officially introduced the fifth generation of Intel Core mobile processors. The lineup is targeting traditional laptops, ultrabooks, 2-in-1 devices, chrome-books, all-in-one items as well as mini-PCs. Besides, the company pin hopes for their CPUs to be additionally implemented within ‘All-inclusive Internet/Internet of Things’ embedded device concept.

New processors are designed according to 14-nm Intel Broadwell architecture. Due to the transition to a brand new technological process, the number of transistors has increased by 35%; herewith, the core area has reduced by 37%. Such innovative move provided for the enhancement of efficiency with simultaneous cut of power consumption. As a result, devices with the integrated Intel Core CPUs are called to run 1.5 hours longer in standalone mode.

The 5th generation lineup might boast the support for the latest codecs (HEVC, VP9, VP8), technologies (Intel WiDi 5.1, Intel RealSense …
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Registered at: 19 May 2012, 19:12
Last visit: 19 May 2012, 19:12