A Low-profile SilverStone NT08-115XP Cooling System

Nowadays compact systems are becoming more widespread, thus increasing the popularity of low-profile cooling systems. Specifically for such systems, the SilverStone Company has designed a low-profile air cooling system under the NT08-115XP codename.



NT08-115XP is announced to be an alternative to a standard cooler out of the CPU supply kit. The manufacturer states, that this cooling system is able to disseminate up to 65 W of heat, so it’s not effective enough to chill down powerfull CPUs.


The dimensions of the SilverStone NT08-115XP cooling system are the following: 101 x 101 x 33 mm. It possesses an aluminum heatsink with a copper center hub. The rotary speed of the 80 mm fan (10 mm thick) is in the range of 1200–3400 rpm, producing an air flow of 5.64–15.98 CFM (9.58–27.15 m3/hr) and a noise level of 16.5–28.98 dBA.


This specialty is compatible with Intel LGA 115x sockets only.


The price has not been voiced yet.

ECS to Implement AMD Memory Profile Support into Its Motherboards

AMD has won a reputation not only for designing and supplying high-end processors but also for introducing its brand memory expansion, codenamed AMD Memory Profile. This development is called to store and share memory settings profiles and to facilitate the search for the most rational settings. Thus, ECS company is going to implement AMP support for DDR3 memory into its future and current lineup of motherboards. According to the available data, AMP technology will be applied to the upcoming motherboards with AMD processors, and to the current products by means of UEFI firmware update. This is the first 'revival' of the technology since its reconsideration and upgrade.



The integrated technology is destined to setup new frequency, voltage and timings showings which will facilitate in keeping DDR3 memory modules stable. As a rule, random-access memory with high frequencies of more than 2GHz require manual system overclocking. AMP will prevent the emergence of errors while setting …

The new version of the chassis from Zalman Z9 Plus

The company Zalman continues to utilize the design of the whole successful chassis Z9, releasing a new model Z9 Plus D4-U3. Perhaps, the only difference from the recent Z9 U3 is the lower part of the front panel, made in the form of letter D.



The list of applied characteristics has remained the same. The body is made of steel and plastic in the form factor Mid-Tower. Its dimensions are 504 (L) x 207 (W) x 464 (H) mm, weight — a little over 7 lbs. Inside can be placed the motherboard ATX or microATX, seven cards PCI-E expansion up to 290 mm, ATX-compatible power supply, three optical drives, and seven hard drives, including two SSD 2.5 format.


The set includes two 120-mm fan — in front with the LED-backlit display and on the back without it. On the input-output is a small information display, two USB 3.0 ports and USB 2.0, Mini-Jack connectors for headphones and microphone.


Zalman Z9 Plus D4-U3 will debut in Japan and perhaps in some other markets, August 19 at a …
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Registered at: 28 October 2012, 14:48
Last visit: 28 October 2012, 16:04