Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.

Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …

ECS to Release a Small-Sized H110S-2P Motherboard

ECS has officially introduced a new mini-STX motherboard, entitled H110S-2P. Featuring 147x140 mm dimensions, the greenhorn is based on Intel H110 chipset for Socket LGA1151 platform. The most peculiar thing about the mainboard is the availability of a full-sized LGA socket which allows for the installation of desktop CPUs (Intel Pentium/Celeron/Core i3/Core i5/Core i7) with the maximal TDP of 65 W.

Upon the whole, the model is targeting small-sized PCs. ECS H110S-2P accommodates a pair of SO-DIMM slots with support for 32 GB of DDR4-2133 MHz memory modules. Storage subsystem is backed by a single SATA 6 Gb/sec port & a single M.2 slot for SSD. There is also another M.2 slot but it is intended for the integration of wireless Wi-Fi/Bluetooth modules.

Audio subsystem is developed on the basis of Realtek ALC662 controller, whereas network facilities – on the basis of Realtek 8111H controller. The motherboard comes equipped with a couple of 3.5-mm audio ports, one RJ-45 …
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Registered at: 23 September 2012, 04:59
Last visit: 29 September 2012, 03:22