Zalman Unveils Nifty Z9 NEO Chassis

Zalman comes out with a new jaunty PC case – the Z9 NEO. The model is available in two paintwork variations (black and white) and is compatible with mini-iTX, micro-ATX as well as full-format ATX motherboards. The mid-tower chassis features 490x482x205 mm dimensions to fit any environment.



Zalman Z9 NEO is estimated for the installation of 7 expansion cards, a pair of 5.25-inch drives, 4x 3.5-/2.5-inch drives, and two solid-state 2.5-inch drives. The layout provides for the installation of 160-mm high CPU coolers, 420-mm long graphics cards, 220-mm long PSUs (ATX PS/2).


The model allows the user to incorporate an efficient cooling system. Hence, there is room for two front fans (120 mm), two top fans with LED backlit, and one rear fan. The other peculiarities of the chassis are as following:


— the employment of soundproof materials on the front panel;

— the integration of a side acrylic window;

— the availability of swappable air filters on the front …

New X99 Gaming 5P Mainboard from Gigabyte

Good news for inveterate gamers: Gigabyte launches a new enthusiast-level motherboard, entitled X99 Gaming 5P. The E-ATX greenhorn is designed in a traditional black-and-red color gamut, accompanied with hand-picked hardware elements, including solid-state capacitors Durable Black, server-type chokes etc. Moreover, its key peculiarity is an advanced monitoring system that allows controlling basic parameters (i.e. overclocking, clock frequencies).



Gigabyte X99 Gaming 5P is developed on Intel X99 chipset, ready to house Haswell-E LGA2011-3 processors with the ultimate TDP level of 130-140 W. The VRM subsystem entails 6-phases, 24-pin ATX and 8-pin EPS connectors. The model boasts eight slots for the latest DDR4-2800 MHz memory kits (up to 64 GB); there is a possibility to install RDIMM modules as well. Expansion slots include four PCI Express 3.0 x16 (with support for 4 video cards in SLI/CrossFireX configurations), three PCI Express 2.0 x1.


To continue, storage subsystem …

Thermalright Launches New Low-Profile CPU Cooler AXP-200

Thermalright, a Taiwanese developer of advanced cooling solutions, enters into the market with a new low-profile CPU cooler – the successor of the last year’s model AXP-100. Codenamed AXP-200, the product features 150x140x60 mm dimensions and is intended to be incorporated into HTPC systems, as well as in compact PC chassis with the support of mini-ITX motherboards. This cooler is compatible with the majority of up-dated platforms, including Intel LGA 1150/1155/2011/1156/1366/775 and AMD Socket AM3/AM3+/AM2/AM2+/FM2/FM1.



The first thing that should be noted about AXP-200 is that it’s a more powerful version of the predecessor, ready to dissipate heat even without the fan from all processors with TDP level of up to 35 W. The other peculiar thing is that the model comes at an attractive price of approximately €50. And finally, framework is one more feature that differentiates AXP-200 from rival products.


Thereby, the cooler from Thermalright has got C-shape framework …
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Acer, inc. Aspire 3680 based on Acer, Inc. Prespa1

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