Meet a New 1200 W PSU SuperNova P2 from Evga

Evga, an award-winning American designer of hardware products for enthusiasts, is about to release a really hard-hitting power supply unit of enthusiast-level – the SuperNova 1200 P2. The model strikes the eye by 80Plus Platinum efficiency, backed by 10-year’s limited warranty. The recommended by the designer retail price won’t trespass the height of $270.



Evga SuperNova 1200 P2 features 1200 W power and 90% efficiency on a typical loading. It teases a totally modular layout system, therewith all cables have an atypical design; the latter is called to optimize the airflow within the PSU case. A set of available cables includes 24-pin ATX, a pair of 4+4-pin EPS12V, ten SATA Power, five MOLEX 4-pin, six 6+2-pin PCI Express Power, and a single FDD Power.


The following power supply unit is furnished with a single +12V rail that is estimated for 99.0 A current intensity. The layout houses first-rate Japanese capacitors with a solid electrolyte, a vertical two-layer main …

The Upcoming Release of Canvio Desk HDD from Toshiba

Toshiba Corporation is about to release a new external HDD series with USB 3.0 interface, codenamed Canvio Desk. Such information has been voiced by the company's press-service. The new series is represented by HDDs of 1TB, 2TB and 3TB volume capacities. One of the major peculiarities ascribed to Canvio Desk models is their compact dimensions; at the same time, these HDDs are able to offer huge capacity and stability of operation.



Toshiba Canvio Desk is delivered in black casing and provides for double localization on a desk. This HDD can be located as vertically so horizontally to ensure the utmost convenience of utilization. The other peculiarity of Canvio Desk drives is the availability of fanless passive cooling system. The implemented USB 3.0 interface is destined to ameliorate all attached operations, starting from data transfer and finishing with backup activity time.


To continue, the manufacturer has taken care of its HDDs' advanced efficiency by delivering the …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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