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Latest known driver: 16.06.2017

OWC Refreshes Its Line of Portable Storage Devices

OWC, a developer and supplier of hardware solutions, has recently complemented its line of portable storage devices with a new model Mercury On-the-Go Pro. The preliminary data provided by the company claims that the new product will be based on triple interface template and will support USB 3.0 interface. However, this does not mean that the device won't be able to support USB 2.0 interface, since it will be backwards compatible with USB 3.0.



OWC Mercury On-the-Go Pro storage will be delivered in a refined transparent casing made of acryl. The nominal dimensions are 140x89x25 mm. The software kit will involve various applets for the backup of data (NovaBackup, Data Backup 3, Carbon Copy Cloner), as well as, a dedicated program for the monitoring over the storage condition and optimization of drives' performance.


The lineup of products will be represented by different modifications of the drives. Thereby, each customer will receive a chance to choose among several versions …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Ultrathin 2.5-inch SSDs from Biwin

Biwin America, Inc., a global manufacturer of solid-state drive solutions for client and corporate needs, has officially announced the release of 2.5-inch SSDs with slim-profile casings. It should be mentioned that decrease in casing dimensions touched upon all 2.5-inch products and series manufactured by the company, including Smart, Pro and Elite Series with SATA 3 and SATA 2 interfaces, as well as Drive NX and NuvoDrive PX Series with SATA 3 interfaces.



Previously all SSDs were developed in 9.5 mm-thin casings, but the current modifications allowed Biwin to decrease the dimensions to 7 mm. This is twenty-six percent less than with preceding models. Hence, slim-profile SSDs are applicable in more compact devices; they are destined to be installed in 1U and 2U server stands. This is called to increase the deployment capacity of the server without sufficient investments. Biwin 7 mm SSDs casings are made of black anodized aluminum to ensure fail-proof characteristics of the …
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PCI%5CVEN_8086%26DEV_1C3A%26SUBSYS_844D1043%26REV_04

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