Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

Point of View strengthens GeForce GTX 680 UltraCharged 4GB of memory

Dutch manufacturer of discrete graphics Point of View considered as a good idea to equip one of the top-end versions GeForce GTX 680 with the prefix UltraCharged with four gigabytes of memory. This graphic card can be a good alternative to existing POV / TGT GTX 680 UltraCharged with 2GB buffer.



The new model, as well as it «precursor», is using the reference design PCB Nvidia with the configuration of additional power connectors PCI-E Power (6 +8)-pin. Typically, the PCB for GeForce GTX 680 is equipped with only four power phases for the GPU, but the version of the UltraCharged Point of View / TGT the fifth one added.


The frequencies remained the same: 1111 MHz for the graphics core (1176 MHz in turbo mode) and 6008 MHz for the 4 GB of memory GDDR5. Under three-slot cooling system, there is GK104 chip in the composition of 1536 shaders and 256-bit memory bus. Point of View marketers emphasize that the graphics processor for the graphics cards GTX 680 UltraCharged …
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