Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Sapphire Outs Nitro Series of Gaming Videocards

Sapphire is about to launch a new series of gaming graphics cards, entitled Nitro. The family counts three models: Nitro R7 370 4G D5, Nitro R9 380 4G D5 and Nitro R9 390 8G D5. Since the models take different GPUs as the basis, they are targeted diverse market segments, taking into account as budget-oriented gamers so spendthrift enthusiasts.



Sapphire Nitro videocards are distinguished by two major features. First of all, they employ a top-notch hardware base consisting of solid-state capacitors and Black Diamond ferrite chokes. Second of all, their cooling system boasts the implementation of a molten heatsink, supplemented by a new coating framework and a kit of fans, based on dual ball-bearings. The fans are equipped with IFC-II intelligent system that halts their rotation on low GPU temperature, ensuring noiseless operation.


Sapphire Nitro R7 370 4G D5 is the most cost-efficient solution within the series. It relies on AMD Radeon R7 370 GPU, running at 985 MHz …

Computer Case be quiet! Silent Base 600 Overview (Part II)

Internal structure

The motherboard compartment is located above the power supply unit. In this regard, everything is quite standard for a Mid Tower class. A large cutout is made in a tray behind a CPU socket, to allow installation of a CPU cooling system directly into the case; a backplate mount (thrust-pad located on the back side of the motherboard) is used for this purpose.


The four large slots in a tray, equipped with the silicone membrane, are designed for proper cable management which looks very promising here. Plugs of expansion slots are attached by thumbscrews. The front part holds a hard disks’ basket for three drives.


At the back side a slot in a tray can be clearly seen to access cable management system slot. Also, the rear side contains two tool kits for installation of solid-state drives and size 2.5" hard disks.


The side cover is made of 0.7 mm steel, and from the inside has a thick vibration and noise absorbing coating. The recess in the …
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