APU AMD A10-4600M Review

Intel and AMD companies have established a good reputation for providing efficient hardware solutions for all customer groups. Each new product introduced by the two companies enters the top sales ranks and this promotes for the competition. AMD has recently produced a new APU solution based on Trinity architecture with graphics module VLIW4 and called it AMD A10-4600M. This model can boast the whole spectrum of improvements and advanced features as compared with its predecessor APU Llano, and is intended to beat its rival Intel in efficiency and performance.



Trinity Architecture


CPU Trinity is based on Piledriver micro architecture which superseded Bulldozer from AMD. The distinctive feature of Piledriver is that it’s primarily integrated in a mobile APU. Quad-core Trinity chips utilize two Bulldozer modules, each of which is equipped with two execution cores. Each APU module employs 2 MB of L2 cache, so the entire module architecture approximates to 4 MB of L2 cache; …

‘Cubic’ Chassis Corsair Carbide Air 540 Review

Corsair is renowned for the whole galaxy of products designed for contemporary PC platforms. Its PSUs, memory modules, SSDs, cooling solutions, peripherals, and cases are widely incorporated in desktop and mobile segments. The latter count a list of series, targeted various customers with various needs. The most peculiar one is Carbide series that currently consists of eight models. Carbide Air 540 differs from its comrades, in the first place, by its cubic framework and, in the second place, by its mini-tower height but midi-tower internal spacing. Those are not the only attractions of the model, since Corsair always offers more than it’s seen on the surface.



Design and Ergonomics


Corsair Carbide Air 540 features 458x322x419 mm dimensions and is distinguished by a rather strict design. Exterior and interior facets are totally painted black, except for ‘Corsair’ label and sockets with inscriptions. The case is made of thin steel but for the external plastic panels …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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