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Zalman Introduces Highly Efficient FX70 Passive Cooler

Zalman, a renowned South Korean designer of various hardware solutions, has recently introduced its latest CPU passive cooler, entitled FX70. The new-entry features 110x140x158 mm dimensions and comes without any fans. However, if there is a need to cool down CPUs with the TDP level higher than 80 W, the customer is free to enhance the facilities by adding two 120 mm fans. The latter are fixed to the heatsink by means of four brackets.

Zalman FX70 is an optimal choice for the following platforms: Intel LGA 2011/1366/115x/775 and AMD FM2/FM1/AM2/AM2+/AM3/AM3+. This cooler fits in any mid-tower ATX and larger PC chassis. The cooler’s framework consists of a copper base, pierced by six nickel-plated heatpipes, and of fifteen heatsink plates with an offbeat design, codenamed Twist; they are called to dramatically improve the process of heat management.

Fanless framework is regarded to be an advantage due to three reasons. First of all, pure heatsink provides absolutely no noise during operation. Secondly, it minimizes any adverse factors triggered by electronics (i.e. vibration). Finally, the plates do not magnetize dust that affects the lifespan.

The model is delivered with a fixing kit, wired brackets, a backplate, and a proprietary Zalman ZM-STG2 thermal compound. The latter significantly improves heat transfer process and is characterized by the highest heat dissipation index. Finally, the FX70 is now available at the price tag of $45.70.
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  • 31 January 2014, 17:17
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