Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.



New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.


Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …

Gigabyte to Release GA-Z170X-SOC Force Mainboard for Overclockers

Gigabyte has expanded its line of overclocking solutions by a new motherboard, codenamed GA-Z170X-SOC Force. The greenhorn is based on Intel Z170 chipset, supporting Skylake-S CPUs for LGA 1151 socket (14-nm technological process). The PCB is distinguished by the inclusion of fiery-orange components and a sophisticated allocation of hardware.



Gigabyte GA-Z170X-SOC Force features 22-phase VRM system and three power connectors: ATX12V, EPS12V & OC PEG. The PCB incorporates such high-quality component as DrMOS PowIRstage from International Rectifier. All power elements might be paired with hybrid cooling; for this purpose, the customer has to acquire G1/4 fittings.


The motherboard accommodates 4 slots for DDR4-3300 MHz RAM with the maximal capacity of 64 GB. Storage subsystem might be organized thanks to 9 SATA III ports, 3 SATA Express ports (10 Gb/sec bandwidth index), 3 M.2 Socket 3 ports (32 Gb/sec bandwidth index), and a pair of USB 3.1 Type-A/Type-C ports. Graphical …

ID-Cooling Hunter Duet II Liquid Cooling System

ID-Cooling, being famous for its cooling systems, has released a Hunter Duet II cooler of large dimensions, which is supposed to transfer heat from the CPU and the graphics engine surfaces. This model is designed with a 360 mm heat sink, which is of great benefit to its efficiency factor.



The construction includes two water units with a base out of copper and built-in pumps, pipes in braided cable, the three-section aluminum 395 × 120 × 27 mm heat sink, three 120 mm fans, and an extraordinary framework with a 90 mm fan to blow over graphics card load-bearing elements and intensive plates for the CPU and GPU.


Though possessing similar construction, water units differ in lids design and the location of holes for liquid flow. At the moment their inner structure details are not available.

A compact fan to blow over VRM consumes 1.2 W. Its rotary speed is not higher than 1,500 rpm. The same ratio of each of the three main fans is not supposed to exceed 1,500–2,000 rpm.

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