PC Chassis Enermax Fulmo ST ECA3270 Review

Enermax, one of the outstanding players in the PSU and cooling market, has recently paid great attention to the development of other hardware pieces, including chassis and cases. Its Fulmo series vindicates that the company has plenty of shot in the locker to beat competitors and marvel customers. Enermax Fulmo ST ECA3270 is probably the most interesting model within the series, with a bit strict, aristocratic design but rich internal layout. But, is that truly so? Let’s find it out.

Design Peculiarities

First of all, it should be mentioned that Fulmo ST ECA3270 comes in two color variations: black and dark-gray. Color is not the only feature that diverges the couple, since black version is furnished with fan backlights. Upon the whole, the model is designed in mid-tower standard and features 244x485x513 mm dimensions. The frontal facet is covered by a steel grid, which hides a non-removable air filter. The facet is blind, except for three grid-like plugs for 5.25-inch …

Universal Laptop Charger FSP NB Q90 Plus Review

The major task of technological progress is to provide people with more efficient, more convenient, and more user-friendly devices to be used at home and in office. The list of all those facilities has become of vital importance for consumer electronics segment. That is because people would like to be saved from multiple wires, cables and schemes when they use their PCs, laptops or other gadgets. Nevertheless, it is impossible to avoid cable grooming when it comes about PSUs or chargers. FSP company dared to solve this problem by releasing a compact and ergonomic laptop charger, codenamed NB Q90 Plus. The employment of this device is called to facilitate the laptop charge-in and save people from cable foul-ups.

Design and Ergonomics

The first thing that differentiates laptop charger FSP NB Q90 Plus from dozens of other models is its dimensions which do not exceed 135x72x19 mm. This makes it easily portable even in a tiny handbag. The series of charges is represented by …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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