Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

VIA Announces the Upcoming Release of VAB-800 Motherboard

VIA Technologies Inc., a global manufacturer of power-efficient processor platforms, has recently announced the release of its peculiar motherboard, codenamed VAB-800. The major peculiarity of these motherboards is that they will be delivered in two variants: with chips of VIA personal production, WonderMedia (800 MHz), and with Freescale ARM Cortex-A8 1 GHz chips. The volume capacities of DDR3 memory in either variant will equal to 1 GB. VAB-800 is developed in piro-ITX form-factor but is also compatible with blocks of ATX form-factor.



Motherboard VAB-800 accommodates flash-memory of eMMC type with the integrated SATA 3 Gbit/sec sockets. The total volume capacity of flash-memory equals to 64 GB. This model can boast a large number of internal sockets, including a couple of RS-232, two LVDS (to enable the connection with the up-to-date monitors), SATA, JTAG, SDIO, RTC, and a slot for the activation of the external power supply.


The manufacturer has taken care of the …

Release of Chassis Aresze Subverter 7650B with Efficient Cooling System

Aresze is going to release its new series of chassis developed in Mid-Tower form factor. Codenamed Subverter 7650B, these chassis are primarily intended at consumers with the heightened demands to the layout and integration but with rather 'modest' financial possibilities. Subverter 7650B series can boast an outstanding efficiency pertained to cooling down. In addition, the internal zoning and integration of this model are similar to that implemented in more costly line of products manufactured by Aresze.



Aresze took all efforts to achieve the maximal results applied to the efficient cooling down. Thus, the framework zoning for the airflow distribution has been designed according to the company's own technology. The bay designated for graphics cards, which can support the cards of up to 300 mm in length, can be applied for the wide range of solutions. The 120 mm fan is located at the top part of the chassis and serve the blowing out means; this way the hot airflow does not …
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