Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

MSI works on development on three Mini-ITX motherboards based on chipsets A85, B75, and Z77

During August, MSI will release the two motherboards LGA1155 form-factor Mini-ITX, based on chipset Intel B75 and Z77. The first is positioned as a budget solution, the second is, in addition to support of overclocking Ivy Bridge K factor, will offer enhanced power system, and integrated Wi-Fi adapter and Bluetooth. Before the start of retail sales APU A-Series/Trinity (October) they will be joined by Mini-ITX motherboard based on chipset AMD A85.



From the pair of tiny “motherboards” B75/Z77 the greatest interest is for last one. The full codename of the model — MSI Z77IA-E53.


The upcoming model has seven power phases of processor socket with elements DrMOS and tantalum capacitors, power connector EPS12V 8-pin, two slots for RAM DDR3 (up to 16 GB of RAM) and a slot PCI Express 3.0 x16. Also, there are two SATA ports with a throughput of 3 and 6 Gb / s, single eSATA and mSATA (3 Gb / s). Jack mini-PCIe 5 GT / s is located directly above the mSATA — the original …

Asus Teases a New Slim ET2321 All-in-One Solution

Asus has recently drawn a huge attention to a particular video clip that demonstrates the company’s newest elaboration – ET2321 all-in-one PC. This product positions itself as a slim, user-friendly and stylish solution for routine tasks and multimedia entertainments. The model features 23 inch display with Full HD resolution (1920x1080) and offers a lot of advanced facilities standard desktop products have.



Asus ET2321 are equipped with Intel Core processors (4th generation). The top version comes with Intel Core i7-4500U CPU that is characterized by high efficiency and low power consumption. Memory subsystem consists of DDR3 modules; the maximal RAM capacity might achieve 16 GB. Graphics facilities are ensured by means of a mobile Nvidia GeForce GT 740M adapter (2 GB) and an inbuilt Intel HD 4000. Network interfaces are introduced by Wi-Fi 802.11 ac and Bluetooth 4.0 modules, whereas connectivity is supported due to six USB ports (3x 2.0 and 2x 3.0).


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Hewlett-Packard HP d530 CMT(DG062A) based on Hewlett-Packard 085Ch

  • CDROM
  • COMPUTER
  • DISKDRIVE
  • DISPLAY
  • FDC
  • HDC
  • KEYBOARD
  • MEDIA
  • MONITOR
  • MOUSE
  • NET
  • OTHER DEVICES
  • PORTS
  • PROCESSOR
  • SYSTEM
  • USB
  • VOLUME