Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.

Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …

Akasa Intros a Small-Sized AK-CC1101EP02 CPU Cooler

Following the release of a low-profile cooler, codenamed AK-CC7122EP01, Akasa is glad to introduce one more small-sized item. The AK-CC1101EP02 features 80x80x28.3 mm dimensions and is predestined to be employed as a part of a compact system within mini-ITX/micro-ATX chassis. The model is compatible with AMD FM1/FM2/754/939/AM2(+)/AM3(+) sockets only.

Akasa AK-CC1101EP02 involves an aluminum heatsink with cam-lever clip installation type, a thermal compound on the base, and a 80 mm fan. The latter is based on EBR bearing and equipped with PWM technology that adjusts the rotational speed from the minimal 600 RPM to the maximal 3000 RPM.

Its efficiency achieves 26.53 CFM, producing up to 27 dB noise. The estimated time of fail-proof operation equals to 40.000 hours. The fan is adjoined to the motherboard via a 4-pin connector and receives voltage power via 12VDC bus.

Just for comparison means, the predecessor — AK-CC7122EP01 – features 85.2x87.2x26 mm dimensions. …

Sapphire Presents New Graphics Card HD 7870 Flex with Dual-X Cooler

Sapphire Technology has officially presented a new model of its graphics card with the implemented unique Flex solution. Codenamed HD 7870 Flex Edition, this card is based on Graphics Core Next architecture developed by AMD. One of the peculiarities observed in this model is the integration of a high-end cooling system Dual-X that is called to ensure efficient cooling down and practically silent work. Dual-X system consists of heat pipes and two fans, the bearings of which accommodate dirt-repellent coverage.

All models of Sapphire Flex series are able to support three DVI monitors in Eyefinity mode and create SLS conditions without the employment of active adapters. Two monitors are connected to the DVI ports, while the third one – to the HDMI to DVI connector. In addition, customers have got real opportunity to connect up to five monitors simultaneously due to the availability of two DisplayPort sockets. This might serve a good background for the creation of solutions for …
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