Universal CPU Cooler Zalman CNPS9900DF Review

Zalman keeps on developing high-end cooling systems with a radial arrangement of plates. Its latest product, CPU cooler CNPS9900DF, is considered to be universal in terms of compatibility and implemented facilities. Still, some IT experts view this model as a modification of previously launched Zalman CNPS9900 MAX, although with two fans. In spite of visual resemblance, the company tried to design a truly uncommon cooler, with remarkable specifications and reliability.



Framework Peculiarities


Zalman CNPS9900DF is distinguished by an unusual framework. It's not a traditional vertical tower, as long as heatsink ribs feature fan-like location relative to the central axis of symmetry. Such approach provides for a comprehensive heat dissipation over all key motherboard components due to absence of frames on fans. Heat pipes embrace the cooling plates in a circle, then bend at 90 degrees, piercing the base. At first sight it seems that the framework involves six heat pipes, but …

PSU Seasonic S12II-520 Bronze Review

Seasonic Electronics has already indulged the community with its PSU solutions of M12II and S12II series. Currently, all the models included to those lineups are marked by 80 Plus Bronze certificate that testify their belonging to the high-end echelon. This year the company has completed the modernization of S12II series to add some advanced characteristics to its products. PSU S12II-520 Bronze is delivered with the nominal power of 520 W and is primarily designated to be employed in gaming PCs with a single high-performance graphics adapter.



Design Peculiarities and Cable Set


Power supply unit Seasonic S12II-520 Bronze goes in ATX 12V form-factor and boasts 80 Plus Bronze standards. The nominal delivery kit is not differentiated by any peculiar components, since the manufacturer included only a detailed user manual, four screws, network power cable, power adapter from PATA to a couple of sockets for FDD connection.


PSU casing is developed in black coloring with the …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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