Minimalism in new Lian-Li PC-Q25 hull

The market of computer components is growing rapidly. The developers of processors integrate in them elements of system logic, graphics core and other components that were recently placed on the motherboard in the form of individual chips. Motherboard manufacturers have begun to integrate their products with network and sound chips even earlier. All this allows making motherboards, and as a result, systems based on them more compact. The company Lian-Li have understood this tendency and provided the market with the entire line of compact hull designed for motherboard size Mini-ITX.



Consider the model Lian-Li PC-Q25:

— Hull Type — Mini-Tower;

— Dimensions in mm — 280 (H) x 199 (W) x 366 (D);

— Material – Aluminium;

— Weight, kg — 3.1;

— Color: Black / White;

— Form Factor — Mini-ITX/Mini-DTX;

— Devices 3.5 "/ 2.5" internal — 7/3;

— Supported number of expansion cards – 2;

— Fans 1x 140mm, 1x 120mm;


Delivery …

Thermalright Readies Le Grand Macho Passive Cooler

Thermalright decided to gladden all devotees of ultra-quiet PC systems by designing an efficient passive cooler – Le Grand Macho. This is a conventional tower cooler, supporting new and outdated CPUs of up to 95 W TDP. Hence, the greenhorn is compatible with Intel LGA 775/115x/1366/2011/2011-3 as well as AMD FM2/FM2+/FM1/AM2/AM2+/AM3/AM3+ platforms.



Initially, Thermalright Le Grand Macho is void of any fan; nonetheless, its framework presupposes the installation of one or two high-efficiency fans (120/140 mm), which are able to cope with 300-watt CPUs.


The cooler consists of a nickel-plated base, seven heatpipes and a voluminous aluminum heatsink with 35 fins. The latter come with perforations which counteract air between the plates with low air resistance. The base features a convex-shaped contact surface (that optimizes cooling efficiency) and is perfectly polished. Seven 6-mm heatpipes are solidly integrated into the base, ensuring ideal heat dissipation.


The …

Transcend to Announce a SuperSpeed USB 3.0 SSD

Transcend Information, a leading designer of storage solutions, announces the launch of its new super high-speed SSD, codenamed ESD200. The drive employs the latest USB 3.0 interface of SuperSpeed generation and is distinguished by truly compact dimensions, providing for the most convenient utilization. The casing is void of movable parts and operates with minimum noise level. Besides, it's based on a set of flash chips and owns anti-heat, shockproof and anti-vibratory properties. The series will be introduced by models of 128GB and 256GB volume capacity.



The implementation of SuperSpeed USB 3.0 interface ensures ten times faster data transfer speed, if compared with the previous USB 2.0 generation. On such conditions, Transcend ESD200 is capable to develop Read speed up to 260 Mb/sec and Write speed up to 225 Mb/sec. This implies that 4.7GB DVD drive full of different content will be copied for fifteen seconds only. However, a new SSD is backwards compatible with USB 2.0; so, …
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