Overview of the ASUS Prime Z270-A Motherboard

Today we’ll have a glance at one of the ASUS Prime series motherboards. The model having A- index has all the necessary basic features, when nothing has yet been simplified, the power subsystem seems to be good enough and there are no additional controllers of any sort.


Technical characteristics

We can see that the PCI, and SATA-E interfaces are already renounced, and the M.2 is increasing its presence. All the other main characteristics are listed below:


• Chipset – Intel Z270 • Processor socket – Socket 1151 • Processors – Core i7, Core i5, Core i3, Pentium, Celeron (Skylake-S, Kaby Lake-S) • Memory – 4 DIMM DDR4 SDRAM 2133/2400*/2666*/2800*/3000*/3200*/3300*/3333*/ 3400*/3466*/3600*/3733*/3866* (OC), a maximum of 64 GB • PCI-E Slots – 2 x PCI Express 3.0 x16 (x16 + x0, x8 + x8) 1 x PCI Express 3.0 x16 (x4)4 x PCI Express 3.0 x1 • M.2 – 1 x PCI Express 3.0 x4 (Key M, 2242/2260/2280/22110) 1 x PCI Express 3.0 x4 (Key M, 2242/2260/2280) • …

NVIDIA to Increase Graphic Performance in Mobile Devices

All new devices that appear in IT market are treated with great attention from the part of contemporary customers. All functional characteristics, design and other possibilities are considered in details. Graphics isn’t exclusion and is always under intent look of users and IT experts. Computer and game console graphics went over the line of unnatural imaging long time ago and became a genuine embodiment of real life. Nowadays it is not a problem for the gamer to totally plunge into the world of fantasy or battle-front since the graphics presents data with real authenticity.



NVIDIA, the world-known developer of discrete graphic chipsets for personal computers and mobile devices, strides confidently in the direction of graphics performance improvement. Company specialists are currently working at the perfection of graphics performance on mobile devices and game consoles. IT analysts dare to assume that functional characteristics of graphic core sets on mobile devices will catch …

Thermalright Unveils a Colossal HR-22 CPU Heatsinks

Thermalright, a top-ranked Taiwanese developer of cooling solutions, has recently unveiled its newest CPU heatsink, entitled HR-22. The new-comer features 120x150x159 mm dimensions and is peculiar by nearly ‘colossal’ cooling effect. The HR-22 is targeting all up-dated platforms with Intel LGA2011/LGA1366/LGA115x and AMD FM1/FM2/AM3/AM3+ sockets. The company promises to start the sales in the nearest future, though pricing is still unknown.



Thermalright HR-22 boasts a tower-like framework, consisting of a copper base, thirty-five aluminum plates, and eight nickel-plated heatpipes (6 mm each). The only hexagonal notch in the center is thought to simplify the heatsink installation.


All the plates contain rectangular holes that facilitate the airflow when used in passive mode. Such peculiarity is called Direct Passive Airflow System (DPAS). It not only provides for an efficient cooling and unimpeded airflow, it saves the users’ ears from noise: a powerful heatsink is …
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Registered at: 25 December 2011, 17:35
Last visit: 25 December 2011, 18:22