Motherboard ASRock Z77 OC Formula Review

The variety of motherboards designed by ASRock is able to satisfy the whims of any customer group. All models are characterized by multiple useful facilities and different price ranges. This makes ASRock products a universal means for PC integration. These days the company has proudly released a dedicated motherboard, codenamed Z77 OC Formula, developed specifically for overclockers. This is the first model of this manufacturer designed particularly with overclocking facilities in mind.



Design and Integration


At first sight, motherboard ASRock Z77 OC Formula does not distinguish itself by exceptional design and layout. However, more intense look will uncover a range of peculiarities pertained specifically to this product. This motherboard is designed in CEB form-factor, since the number of integrated facilities would be scant for ATX standard. Still, fixing holes are located similarly to ATX boards, so there won't be any difficulties during its installation.


It should …

HP Employs Processors AMD Athlon II X2 221 and Sempron X2 198

The release of hybrid AMD processors of A series was announced about a year ago, however, their actual appearance in the market was delayed for a few months. It is a well-known fact that a part of those processors for Socket FM1 platform has got idle graphics block; this part of processors has been codenamed Athlon and Sempron. The two processor models from this series Athlon II X2 221 and Sempron X2 198 can be currently found in PCs manufactured by HP company.



Both processors have been observed in the list of specifications of desktop PCs delivered by HP: Athlon II X2 221 is employed in HP Pavillon p6-1169cx and p6-1226cn models, while Sempron X2 198 is employed in HP Pavillion p6-1152cx, 1230cx, 1231cx, and 1159cx models. The major peculiarity of such technological solution is that HP PCs with those processors are delivered only to the Chinese market.


Two-core Athlon II X2 221 operates at 2.8 GHz frequency, and accommodates 1 MB cache memory of the second level. It is …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 14 April 2012, 21:12
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