VIA Announces the Upcoming Release of VAB-800 Motherboard

VIA Technologies Inc., a global manufacturer of power-efficient processor platforms, has recently announced the release of its peculiar motherboard, codenamed VAB-800. The major peculiarity of these motherboards is that they will be delivered in two variants: with chips of VIA personal production, WonderMedia (800 MHz), and with Freescale ARM Cortex-A8 1 GHz chips. The volume capacities of DDR3 memory in either variant will equal to 1 GB. VAB-800 is developed in piro-ITX form-factor but is also compatible with blocks of ATX form-factor.



Motherboard VAB-800 accommodates flash-memory of eMMC type with the integrated SATA 3 Gbit/sec sockets. The total volume capacity of flash-memory equals to 64 GB. This model can boast a large number of internal sockets, including a couple of RS-232, two LVDS (to enable the connection with the up-to-date monitors), SATA, JTAG, SDIO, RTC, and a slot for the activation of the external power supply.


The manufacturer has taken care of the …

Thermalright Readies Le Grand Macho Passive Cooler

Thermalright decided to gladden all devotees of ultra-quiet PC systems by designing an efficient passive cooler – Le Grand Macho. This is a conventional tower cooler, supporting new and outdated CPUs of up to 95 W TDP. Hence, the greenhorn is compatible with Intel LGA 775/115x/1366/2011/2011-3 as well as AMD FM2/FM2+/FM1/AM2/AM2+/AM3/AM3+ platforms.



Initially, Thermalright Le Grand Macho is void of any fan; nonetheless, its framework presupposes the installation of one or two high-efficiency fans (120/140 mm), which are able to cope with 300-watt CPUs.


The cooler consists of a nickel-plated base, seven heatpipes and a voluminous aluminum heatsink with 35 fins. The latter come with perforations which counteract air between the plates with low air resistance. The base features a convex-shaped contact surface (that optimizes cooling efficiency) and is perfectly polished. Seven 6-mm heatpipes are solidly integrated into the base, ensuring ideal heat dissipation.


The …

Spire Debuts with Gaming PC Chassis X2.6019

Spire Corporation put itself on record with a new gaming PC chassis, codenamed X2.6019. The new-comer is developed in mid-tower form-factor, featuring 520x215x508 mm dimensions, and is made of 0.6 mm cold-rolled galvanized steel (SECC). Despite medium dimensions, it might easily accommodate motherboards of miniITX, microATX and ATX standard. According to Spire, this model belongs to MOD solutions, since it ensures an easy access to the hardware components during modification or update of the system.



Spire X2.6019 houses four external bays for 5.25-inch drives, six internal bays for 3.5-inch drives, as well as seven slots for PCI expansion cards. Its internal layout is divided by linear plates into three sections; such framework promotes for a better heat removal. It should be mentioned that this chassis is able to lodge nearly any CPU cooler and any high-end graphics card. Moreover, drive mounting can be realized without any dedicated tools.


To continue, this PC chassis …
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Registered at: 10 August 2012, 16:00
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