A 55” AIO by Cisco Performs at Least Three Functions for the Perfect Conferencing Experience

The Cisco Company has demonstrated a new huge all-in-one PC, called Spark Board.



This device has got a 55-inch 4K UHD touch screen, though, an optional 70” version is forthcoming. Key Spark Board specifications also include a camera, supporting 4K video, speakers, several microphones, wireless interface adapters, HDMI, Gigabit Ethernet and two USB 3.0 ports. The Cisco AIO is driven by the NVIDIA's Jetson TX1 supercomputer with 1 TFLOPS Tegra SoC.

The platform under consideration was chosen to implement benefits of Cisco Spark Board OS functions.


Mostly the novelty is intended for meetings and simultaneously operates as a screen for presentations, an interactive board for collaboration and a conferencing device.


Spark Board weighs 39.8 kg and is 814 х 1283 х 49 mm in size. It is available at the cost of $5000 plus one should pay extra $200 per month for the software.

Cooler Master V4 GTS Review: CPU Cooler with a Horizontal Vapor Chamber

The emergence of high-efficient processors incited the necessity to provide high-efficient cooling. It’s not a secret that utmost system performance directly depends upon CPU conditions. The more intense the loading is, the more appropriate thermal environment should be. Here everything is interrelated. Cooler Master, being one of the foremost global manufacturers of cooling solutions, always tries to comply with the rising demands to CPU thermal conditions. Thus, the launch of another cooler intended for extreme heat dissipation was quite an expected event. Codenamed V4 GTS, the product differentiates itself by the availability of a horizontal vapor chamber that enhances the cooling effect.



Design and Integration


Cooler Master V4 GTS features an unusual design, resembling a truck’s engine. Its surface is totally covered by a plastic shield, except for bare heatsink ribs at both sides. The overall framework has got symmetric elaboration with a well-considered …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 07 June 2012, 12:26