Intel to Take Care about Power-Efficiency of Ivy Bridge Processors

The rising competition between the two giants in the manufacture of processing units, Intel and AMD, makes each of the two invent ever newer technologies and implement them in their products. The attempts to dominate in the market and win as many consumers usually develop into brand new approaches and brand new advanced facilities.



In this light, Intel is going to upgrade its Ivy Bridge processors to make them more power-efficient. But power-efficiency does not imply that processing units will show less performance; quite the contrary, the manufacturer is willing to combine an utmost performance with the maximal power efficiency level.


Currently, the most power-saving processors of Ivy Bridge generation can be found in mobile devices on Windows platform and in Apple MacBook Air devices. Their TDP level is recorded at 17W. As appears from the above mentioned, the TDP level in upgraded Ivy Bridge processors will be lower than 17W, though the developers do not voice the margin …

Thermaltake Introduces Mid-Tower Soundproof Chassis New Soprano

Thermaltake proudly introduces a new series of PC chassis, codenamed New Soprano. The series is represented by two models: a model with totally white external casing New Soprano Snow Edition and a model with totally black casing. Both chassis are developed in Mid-Tower form factor and are a perfect choice for high-end systems with minimal noise effect. They are predestined for the employment with the motherboards of ATX and micro-ATX dimensional type.



The major privilege of the series is seen in the implementation of soundproof casing that saves the user from bothersome noise. The casing employs steel as the major material (SECC) and features plastic clipboard. The walls are covered by a soundproof foam from the inside and provide for the utmost silence facilities.


The top panel accommodates an integrated dock-station used for the connection of a single 2.5/3.5-inch winchester. The upper part of the facade is equipped with two USB 2.0 and two USB 3.0 ports, as well as a …

Spire Debuts with Gaming PC Chassis X2.6019

Spire Corporation put itself on record with a new gaming PC chassis, codenamed X2.6019. The new-comer is developed in mid-tower form-factor, featuring 520x215x508 mm dimensions, and is made of 0.6 mm cold-rolled galvanized steel (SECC). Despite medium dimensions, it might easily accommodate motherboards of miniITX, microATX and ATX standard. According to Spire, this model belongs to MOD solutions, since it ensures an easy access to the hardware components during modification or update of the system.



Spire X2.6019 houses four external bays for 5.25-inch drives, six internal bays for 3.5-inch drives, as well as seven slots for PCI expansion cards. Its internal layout is divided by linear plates into three sections; such framework promotes for a better heat removal. It should be mentioned that this chassis is able to lodge nearly any CPU cooler and any high-end graphics card. Moreover, drive mounting can be realized without any dedicated tools.


To continue, this PC chassis …
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Registered at: 12 September 2012, 18:43
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