Core G21 Tempered Glass Edition Is a New Chassis by Thermaltake, Aimed at Showy Gaming Systems

Thermaltake is launching Core G21 Tempered Glass Edition, aimed at building glamorous gaming systems.



The novelty is performed in the Mid Tower format. Side panels are made out of 4 mm tempered glass, which gives a perfect view of inner components.


Core G21 Tempered Glass Edition is ready to hold ATX, Mini ITX and Micro ATX motherboards. Up to seven expansion cards can be utilized. There is also enough space for 2.5’’ storage devices, as well as for two 3.5’’ or 2.5’’ drives. The case encloses up to 410 mm graphics accelerators. A CPU cooler can be 160 mm high, and a power supply can be 220 mm long.


Customers can install fans in the front (3 × 120 mm or 2 × 140 mm), rear (1 × 120 mm, pre-installed), upper (1 × 120 mm or 1 × 140 mm) and lower (1 × 120 mm) areas. Liquid cooling systems can be used with a 360/280 mm heatsink (in front) or 120 mm radiator (in the back).


The Thermaltake specialty with 476 × 208 × 471 mm dimensions weighs 8.05 kg. …

HIS submitted a non-reference card Radeon HD 7970 X

Hightech Information System Company has completed the development of its secret weapon — the video card HIS 7970 X. The relatively modest-looking product, according to producer’s statement, is equipped with a (18 +1 +1)-channel power supply system, high-performance cooler IceQ X2 and non-standard set of ports — four Mini DisplayPort, single DVI and HDMI. The technology AMD Eyefinity 6 is supported — simultaneous work with six monitors. Clock frequency speeds up model 1000/6000 MHz for core and memory respectively. Hong Kong vendor assigns a novelty to a class of graphics cards Radeon HD 7970 GHz Edition.



The cooler is composed by a copper base, three 6-mm and two 8-mm heat pipes, ribs (cooler chips on the VRM and RAM), an aluminum radiator. A pair of 90-mm fan cool the core of Tahiti XT (2048 shaders, 384-bit memory bus) which combines with 3072 MB of memory GDDR5. Additional power is provided by two 8-pin connectors PCI-E Power, in addition memory individually powered …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.



New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.


Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 31 March 2012, 02:22
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