Sapphire Unveils Small-Sized R9 285 2GB GDDR5 ITX Compact Edition Graphics Cards

Optimized energy efficiency offered by AMD Radeon R9 285 graphics adapters has become a key factor for Sapphire to elaborate a pair of original proprietary versions. The new-comers, codenamed R9 285 2GB GDDR5 ITX Compact Edition, are targeting mini-ITX systems with huge performance ambitions. The pair traditionally involves a standard model with etalon specifications and OC model with a factory overclocking.



Both graphics cards employ a small-sized two-slot cooler that consists of a compact heatsink, four copper heatpipes, and a single fan of 100 mm dimensional type. Connection with PC monitors and other visual solutions is realized by means of HDMI, DVI-I, and a couple of mini-DisplayPorts. Additionally, the models feature dual BIOS chips (standard and UEFI) which might be switched with the help of a dedicated key on the case.


To continue, Sapphire R9 285 2GB GDDR5 ITX Compact Edition and OC Edition are based on AMT Tonga GPU (28 nm, GCN) with 1792 stream processors, 112 …

BitFenix Offers Neos Chassis in 6 Color Variations

BitFenix Design Lab announces the release of a new PC chassis entitled Neos. Its major attraction is the availability of six different color versions of enclosures. Moreover, some of the models come with an acrylic window on the side panel but the others have a blind facet. Upon the whole, Neos boasts a durable steel case of 470x185x429 mm dimensions, featuring mid-tower form-factor.



BitFenix Neos is intended to support motherboards of ATX, micro-ATX and mini-ITX standard. The layout offers a couple of external 5.25-inch drive seats, three internal 3.5-inch drive seats, as well as three internal 2.5-inch drive seats. Expansion facilities are maintained by means of seven PCI expansion slots. It should be noted that the chassis’ layout presumes individual placement of bays for the drives, dedicated screwless mounting for ODD, and special apertures for cable management.


All the models are equipped with a single pre-installed rear fan of 120 mm dimensional type. In addition, …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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