Apacer to Release DDR3 Memory Modules of Armor Series

About a month ago Apacer Technology announced the release of new DDR3 memory modules to replenish Armor series. Codenamed Apacer Armor DDR3, these modules are chiefly targeting overclockers and inveterate gamers who long for the high-speed performance in various environments. Good news for all Apacer's customers is that the release of these outstanding products is scheduled for the mid January, 2013.



Modules Armor DDR3 consist of heatsinks which resemble 'armor', while the series itself is represented by the items of various colors, including red, yellow, blue, and black versions. This way the customer will be able to select the most suitable module to correspond to the overall chassis and motherboard color gamma. The heatsinks feature quite typical dimensions and this automatically eliminates all problems connected with the installation of voluminous CPU coolers.


The implemented printed circuit board is given black coverage in combination with eye-catching yellow, blue …

The High-End M.2 ADATA XPG SX7000 Drive with a PCI Express 3.0 x4 Interface

The novelty by ADATA – XPG SX7000 – has recently joined the company’s model line of high-speed solid-state drives. This product is performed in the M.2 2280 format and operates on the base of 3D NAND TLC chips and SMI controller. The manufacturer offers four capacity options, namely 128 GB, 256 GB, 512 GB and 1 TB.



The PCI Express 3.0 x4 interface and the NVMe 1.2 specification make ADATA XPG SX7000 highly efficient. It ensures the 1,800 MB/s of reading and 850 MB/s of writing speed. The random performance at 4 KB data handling corresponds to 130,000 and 140,000 IOPS. Thus, these rates are much higher than those of standard HDD and SATA SSD, which provides a perfect system responsiveness, as well as high productivity.


Additionally the ADATA XPG SX7000 SSD features the DRAM memory cache and supports SLC Caching, LDPC ECC, RAID Engine and Data Shaping. The 5-year warranty is supplied.

AMD Announces the Development of Steamroller

Heightened demand for high-end processor solutions and ever rising competition make AMD constantly develop its products. This usually results in the release of really outstanding items, such as already acknowledged Bulldozer and Piledriver. Therefore, according to the words of the companies technical manager, Mark Papermaster, the development of a new processor architecture, codenamed Steamroller, is already on order of AMD's business. The ready-made products are sure to be released next year. Steamroller is called to become the third edition of Bulldozer architecture that launched last year and a loyal companion of Piledriver core.



The initial data witness that processors on Steamroller architecture will be designed in correspondence with 28 nm technological process. This should favorably affect their efficiency and enlarge the performance by 15-20% at equivalent power consumption and clock frequency. At the same time, Steamroller will improve all specifications implemented in …
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Registered at: 18 November 2011, 09:14
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