Company LEPA produces new power supplies B-series

LEPA introduced three new power supplies — B650-SA, B700-MAS and the B800-MAS, which will replace older models B750-MA, and B850-MA. Newcomers have been certified with 80 Plus Bronze (efficiency of 88% of the networks 230V), and met the standards of ATX12V v2.3 and EPS12V 2.92, and positioned as solutions for gamers and owners of GPU configurations SLI and CrossFire, workstations and small servers.



New items are equipped with inverter DC-DC (to improve stability), have the topology of Double Forward Circuit, as well as high-quality electrical components: solid capacitors and heat resistant (105 ° C) capacitors made in Japan.


Active cooling LEPA B700-MAS/B800-MAS is provided by 140-mm fan on double bearings. The model B650-SA has a fan size of 120 mm. The intensity depends on the rates of temperature sensor. Power Cables PCI-E, SATA and Molex flat are detachable. The main ATX 24-pin, as well as “CPU” EPS12V 8-pin are collected in a nylon sheath. LEPA B650-SA has …

Meet Strike-X Air and Vx Advance Series from Aerocool

Devotees of a futuristic design and uncommon framework cannot but revel in the launch of new chassis Strike-X Air from Aerocool developers. The long-awaited product is already in the market, as well as new Vx Advance series. Chassis Strike-X Air is distinguished by the ultra-original design and open-end framework type. According to the words of Aerocool representatives, the major emphasis has been made on the handiness of usage so that each person could have a direct access to any component of the chassis.



The chassis of Strike-X Air is made of steel and supports motherboards of Micro ATX, E-ATX and ATX dimension type, and graphics cards of 330 mm. length. Expansion cards and interface panels are installed due to the ten slots in the rear part of the device. The chassis is equipped with three external modules of 5.25 and 3.5 inches type. The clipboard is intended for a single USB 3.0 socket, three USB 2.0 sockets, and a couple of 3.5 mm. sockets for headsets with a microphone. … …

Intel to Take Care about Power-Efficiency of Ivy Bridge Processors

The rising competition between the two giants in the manufacture of processing units, Intel and AMD, makes each of the two invent ever newer technologies and implement them in their products. The attempts to dominate in the market and win as many consumers usually develop into brand new approaches and brand new advanced facilities.



In this light, Intel is going to upgrade its Ivy Bridge processors to make them more power-efficient. But power-efficiency does not imply that processing units will show less performance; quite the contrary, the manufacturer is willing to combine an utmost performance with the maximal power efficiency level.


Currently, the most power-saving processors of Ivy Bridge generation can be found in mobile devices on Windows platform and in Apple MacBook Air devices. Their TDP level is recorded at 17W. As appears from the above mentioned, the TDP level in upgraded Ivy Bridge processors will be lower than 17W, though the developers do not voice the margin …
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Registered at: 26 June 2012, 11:06
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