Cooler Master Launches High-End Cosmos SE Chassis

Cooler Master, a Taiwanese designer of prime-quality PC hardware, started selling its fresh Cosmos SE (codename COS-5000-KKN1) chassis. The product is developed in mid-tower form-factor and positions itself as a miniature copy of the earlier released Cosmos II full-tower model. The latest entry distinguishes itself by an extraordinary design and an unbelievable capaciousness. The steel and aluminum case has got a totally black coating (interior and exterior); it features 264x569x524 mm dimensions.



The Cosmos SE is delivered in two framework variations: with absolutely blind side panels and with a stylish acrylic window. In order to provide comfort during transportation, Cooler Master has furnished the chassis with convenient carrying handles. The frontal facet is rich in six USB ports (a pair of 3.0 and four 2.0 ports) and in a dedicated button for the fan backlight adjustment.


This chassis model supports standard ATX and even larger motherboards (micro-ATX and E-ATX), as …

Novelties by FSP – Windale 6 and Windale 4 Coolers – Are Compatible with All Modern Platforms

FSP, a well-known power units vendor, releases two new CPU cooling systems, namely the Windale 6 and Windale 4.



Windale 6 has 6 copper heat pipes and an array of appropriately sized aluminium fins. The Windale 4 construction includes 4 heat pipes and a diminished stack of fins. The products are of 240 and 180 W heat sink capability respectively.


Both cooling systems have one 120 mm fan with a friction bearing. Due to the PWM technology support the rotary speed can be adjusted in the range of 600–1,600 rpm. The ultimate air flow rate equals to 60 CFM (102 m³ per hour) at the 32 dBA noise level. The master model’s fan is supplied with blue LED- backlighting. The specialties from FSP are compatible with all modern platforms, including AMD AM4 and Intel LGA2011(-3).


Windale 6 weighs 823 g and features the 122 х 110 х 165 mm dimensions; and Windale 4 weighs 620 g and is of 122 х 83 х 158 mm size. These products are already available to official retailers. The …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 28 March 2011, 21:27
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