Aerocool to Advance Project 7-Chassis 1

Aerocool has just announced the release of a new stylish chassis, codenamed Project 7-Chassis 1. The greenhorn is distinguished not only by a catchy exterior but also by a spacious interior. The case houses a side window, made of a tempered glass, as well as a LED backlight on the front panel; the latter is regulated by means of dedicated buttons on the top facet.



Featuring 550x446.4x244.6 mm dimensions, Aerocool Project 7-Chassis 1 is ready to welcome motherboards of mini-ITX/micro-ATX/ATX format with up to 7 expansion slots. There are six slots in total for the mounting of drives: a pair of 3.5-inch bays and four 2.5-inch items. The layout allows for the integration of a 165-mm high CPU cooler and a 400-mm long video card (+ a standard ATX PSU).


The model comes equipped with a single pre-installed 120-mm fan on the rear plate. There is a possibility to enhance cooling with the help of five additional fans, mounted on the front and top panels. The user is able to manage …

Motherboard ASUS ROG Maximus IX Formula Overview

ASUS ROG Maximus IX Formula occupies the top lines in the based on the newest chipsets motherboards’ family. The main specialties of this model are: a special supply chain radiator with integrated water-block, ROG Armor cover, the preset wireless network adapter. The engineers also paid more attention to the setting up and monitoring of the LSS.


Features:

• Chipset: Intel Z270 • Processor socket: Socket 1151 • Processors: Core i7, Core i5, Core i3, Pentium, Celeron (Skylake-S, Kaby Lake-S) • RAM: 4 DIMM DDR4 SDRAM 2133/2400/2666 * / 2800 * / 3000 * / 3200 * / 3300 * / 3333 * / 3400 * / 3466 * / 3600 * / 3733 * / 3866 * / 4000 * / 4133 * (OC) a maximum of 64 GB • PCI-E Slots: 2 x PCI Express 3.0x16 (x16 + x0, x8 + x8) 1xPCI Express 3.0 x16 (x4)3xPCI Express 3.0 x1 • M.2: 1 x PCI Express 3.0 x4 (Key M, 2242/2260/2280/22110) 1 x PCI Express 3.0 x4 (Key M, 2242/2260/2280) • Integrated graphics core (processor): Intel HD 510/530/610/630

• Video input: …

Thermalright Launches New Low-Profile CPU Cooler AXP-200

Thermalright, a Taiwanese developer of advanced cooling solutions, enters into the market with a new low-profile CPU cooler – the successor of the last year’s model AXP-100. Codenamed AXP-200, the product features 150x140x60 mm dimensions and is intended to be incorporated into HTPC systems, as well as in compact PC chassis with the support of mini-ITX motherboards. This cooler is compatible with the majority of up-dated platforms, including Intel LGA 1150/1155/2011/1156/1366/775 and AMD Socket AM3/AM3+/AM2/AM2+/FM2/FM1.



The first thing that should be noted about AXP-200 is that it’s a more powerful version of the predecessor, ready to dissipate heat even without the fan from all processors with TDP level of up to 35 W. The other peculiar thing is that the model comes at an attractive price of approximately €50. And finally, framework is one more feature that differentiates AXP-200 from rival products.


Thereby, the cooler from Thermalright has got C-shape framework …
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Registered at: 06 August 2012, 13:45
Last visit: 06 August 2012, 13:58