Meeting New Cooling System Brocken 2 from Alpenfoehn

Only a couple of weeks are left till the official release of a new cooling system Brocken 2 designed by Alpenfoehn. This is a long-awaited launch, since the fist version of the system, entitled Brocken, was honored to gladden the audience long time ago. Hereby, Brocken 2 has got a wee bit modified framework, if compared with the predecessor. Its dimensions together with a fan equal to 146x100x165 mm.



The base is shaped by means of five 6 mm copper heat pipes, tightly pressed together. Aluminum plates of the heatsink seem to be ‘cut’ in the center, unlike the one-piece construction of plates implemented in Brocken.


Active cooling power is ensured by a nine-blade fan of 140 mm standard size, known as WingBoost 2. The fan supports PWM technology that allows altering its rotational speed within the boundaries of 400-1100 RPM. Its activity stimulates the airflow index of 109 CFM, while the noise level barely achieves 19.6 dB (A). WingBoost 2 features small distance between …

Thermalright Launches New Low-Profile CPU Cooler AXP-200

Thermalright, a Taiwanese developer of advanced cooling solutions, enters into the market with a new low-profile CPU cooler – the successor of the last year’s model AXP-100. Codenamed AXP-200, the product features 150x140x60 mm dimensions and is intended to be incorporated into HTPC systems, as well as in compact PC chassis with the support of mini-ITX motherboards. This cooler is compatible with the majority of up-dated platforms, including Intel LGA 1150/1155/2011/1156/1366/775 and AMD Socket AM3/AM3+/AM2/AM2+/FM2/FM1.



The first thing that should be noted about AXP-200 is that it’s a more powerful version of the predecessor, ready to dissipate heat even without the fan from all processors with TDP level of up to 35 W. The other peculiar thing is that the model comes at an attractive price of approximately €50. And finally, framework is one more feature that differentiates AXP-200 from rival products.


Thereby, the cooler from Thermalright has got C-shape framework …

Meeting New Gaming Memory Kits AMD Radeon RG2133



A couple of days ago AMD introduced a new series of DDR3 memory kits within the boundaries of AMD Unified Gaming Strategy development. Codenamed AMD Radeon RG2133, the new-comers are available in two- and four-channel kits, the overall capacity of which equals to 16 GB and 32 GB correspondingly. The most striking feature is that they can be employed as on AMD, so on Intel platforms, supporting AMD AMP and Intel XMP technologies for improved settings optimization.


The other peculiarity is that these memory kits run at 2133 MHz frequency. On such conditions there is always a chance to dramatically increase the system performance up to 22% (with APU AMD A10 on board). Herewith, voltage index equals to 1.65 V, while latency index looks the following way: 10-11-11-30. Memory chips are cooled down by the forces of a high-quality aluminum heatspreader. Its design is called to ensure a stable operation in response to the increased frequencies.


There is one more advantageous …
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Registered at: 28 May 2012, 16:53
Last visit: 28 May 2012, 16:53