ECS Intros a Series of H81 Motherboards with Durathon Support

ECS proudly introduces a series of new motherboards, based on Intel H81 Express chipset. The series consists of three models (H81H3-A3, H81H3-M7, H81H3-I) that support Socket LGA1150 platform and are ready to work with Intel Haswell processors. All three products are developed in different form-factors: standard ATX, microATX and mini-ITX. Therefore, the users have got a chance to choose which item is more appropriate for the assembling of systems with various performance requirements.



Despite the fact that the new-comers position themselves as entry-level solutions, ECS has taken care of their reliability and stability of operation. Therein, it incorporated Durathon technology, which is responsible for the products’ eligible work during a long period of time. Durathon implies the employment of a PCB with high density in order to protect the components from the detrimental effect of moisture, the replacement of standard capacitors to solid-state analogues with prolonged …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …

AMD Highlights Plans for the Transition to the 28nm Process

AMD is a company known for the continual and elaborate work on the development and improvement of all product lines, as well as technological standards. Thus, the coming 2013 year is supposed to be portentous for the company in terms of the implementation of 28nm standards in their APU. AMD has recently voiced the plans for the change of the Trinity APU to a new model, codenamed Richland, and the transition to 28nm technological process.



The new APU, Richland, is presumably to be released in two versions: dual-core and quad-core. It will support a number of high-performance technologies, such as Blu-ray 3D, dual graphics, Open CL, AMD turbo core overclocking, and some others.


According to the preliminary information, Richland will employ FM2 socket (which Trinity employs) and Radeon 8000 series DirextX 11 GPU. This GPU will be furnished with 128 cores in dual-core model line, and with 384 cores in the high-end A10 APU. The same number of cores has been implemented in …
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