Asus is going to put on sale its newest LGA1150 motherboard of ROG (Republic of Gamers) series, entitled Maximus VI Formula. The board features ATX form-factor and is based on Intel Z87 chipset that supports all Haswell-based Intel Core processors. The most peculiar thing about the new-comer is the availability of ROG Armor enclosure that covers the PCB on both sides. The top cover is made of ABS; it prevents the heat produced by the surrounding components (i.e. graphics adapters) from warming up the CPU and VRM systems. The rear cover is made of SECC steel that stops the PCB from bending.



Motherboard Maximus VI Formula houses four DIMM slots that support up to 32 GB dual-channel DDR3 memory modules with up to 3100 O.C MHz frequencies. 8-channel VRM system consists of NexFET transistors, Black Wing throttles, and high-efficiency solid-state capacitors. All power components are cooled down by a dedicated heatsink that is a part of a liquid-cooling system. This motherboard model …

Shuttle is happy to introduce its new elaboration – barebones system on Intel Haswell basis, codenamed SH87R6. The new-comer joins the ranks of XPC series and features 332x216x198 mm dimensions. It offers all users freedom in assembling PC systems of various configurations and is predestined to be employed as HTPC system or as a device for professional digital multimedia.



Mini-PC Shuttle SH87R6 supports the latest Intel’s processors of Intel Haswell family (Core i3/i5/i7) and comes with an integrated Intel HD Graphics that is compatible with DirectX 11.1 technology. Haswell-based systems might boast some striking performance and computing characteristics. The model comes also with four full-size DIMM slots for the integration of DDR3 memory modules (up to 1600 MHz and 32 GB capacity) and 300W PSU, certified with 80Plus Bronze standard. The latter is able to provide for the best efficiency and power-saving operation.


Expansion facilities are offered by one PCIe x16 slot …

Thermalright is about to release a new ‘tower’ CPU cooler, codenamed Archon IB-E X2. Featuring 155x106x170 mm dimensions, the model supports Intel LGA 2011/115x and AMD FM1/AM2+/AM3+/FM2+ platforms. The launch date is on hold, though the recommended price might rise up 65 EUR.



Thermalright Archon IB-E X2 consists of a voluminous aluminum heatsink with 43 thin pins, which are pierced by eight U-shape nickel-plated heatpipes, and a polished copper base also with a nickel-plated coverage.


The framework is replenished by two 140 mm fans Thermalright TY-141; they are thought to support PWM technology that promotes for speed variation from 900 RPM to 1300 RPM. The fan blades produce up to 74 CFM airflow, consuming not more than 2.4 W power. Average noise level fluctuates within the measures of 17-21 dB.


Moreover, the vendor equips the cooler with a brand thermal compound — Thermalright Chill Factor III. The latter transcends common Chill Factor item in terms of heat …