Cooler Master is going to release V8 GTS CPU cooling system – the newest addition to V-series products. The model has got a spectacular design with a large heatsink block, two high-performance fans, and black plastic coverage. The overall cooler’s dimensions make up 154x149.8x166.5 mm. V8 GTS is differentiated also by a high compatibility with a range of CPU sockets, naming AMD AM2/AM2+, AM3/AM3+, FM2/FM1 and Intel LGA2011/1366/1156/1155/1150/775.



Unlike other air-coolers, an elaboration from Cooler Master can boast the availability of a vapor chamber in the framework. This chamber is known to spread heat much faster than heatpipes do and protects the CPU from overheating on heightened loading. Moreover, the presence of this vapor chamber guarantees that the heat is evenly distributed between all incorporated heat pipes.


Except the above mentioned components, V8 GTS framework consists of three independent heatsink blocks, eight copper heat pipes, and a pair of 140 mm …

HP comes out to the market with a new 31.5-inch monitor Z32x as a part of DreamColor series. The new-comer features 737x613.8x245.5 mm dimensions and is based on IPS panel. It is differentiated by extended options on profile settings and the availability of an ergonomic stand. HP promises to launch the display in June 2015.



HP DreamColor Z32x supports Ultra-HD 4K resolution (3840x2160) and offers the following specifications: 1000:1 static contrast index, 500.000:1 dynamic contrast index, 300 cd/m2 utmost brightness, 8 ms GtG response time, 178/178 degrees utmost viewing angles, 1.07 billion of displayed colors. The integration of a built-in server enables a comprehensive remote control over all key parameters via Ethernet channels.


This monitor is supposed to cover 100% of sRGB environment, 99% of DCI-P3 environment and 99.5% of AdobeRGB environment. It boasts the implementation of 10-bit color presentation and the possibility to select preset profiles (sRGB D65, Adobe …

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.



New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.


Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …