Asus has lately announced the release of a new desktop PC that positions itself as the first ever desktop solution with the support of Near Field Communication (NFC) technology. Entitled Asus M70, the product allows for the wireless interaction and data transfer with the compatible mobile devices on Android platform. For instance, a dedicated NFC Express software app enables an automatic copying of photo/video files from the smartphone or tablet to the PC.



Asus M70 is housed in a silver case, which is differentiated by a laconic but stylish design with a luminous stripe on the frontal facet. As for the internal layout, this model is available in several variations on the basis of two-core Intel Core i7/i5/i3 CPUs (4th generation chips) and graphics cards of Nvidia GeForce family (up to GeForce GTX 650 series). Operational management is entrusted to the newest OS Windows 8.


The implementation of a built-in uninterrupted power supply (UPS) is considered to be one of the …

Colorful, a Chinese developer of graphics solutions, unveils some details about its new graphics card, codenamed iGame GTX 650 Ti Buri-Slim. The most peculiar thing about this card is that it takes only one slot within a PC case, if compared with similar models from other manufacturers. The model's design resembles the one implemented in a 2011 release (iGame GTS 450 Buri-Slim).



Colorful iGame GTX 650 Ti Buri-Slim is based on a non-reference printed circuit board; the latter is a bit longer than reference GTX 650 Ti. Hardware base deserves special attention, since it's been given a note of originality, despite being a part of the entry-level adapter. Instead of traditional solid-state capacitors Colorful implemented POSCAP capacitors. Power subsystem is organized according to 3+1 template; it employs high-efficiency transistors designed by ON Semiconductor.


The integrated graphics chip and memory modules of GDDR5 standard operate at 928 MHz and 5400 MHz correspondingly. …

Zalman, a renowned South Korean designer of various hardware solutions, has recently introduced its latest CPU passive cooler, entitled FX70. The new-entry features 110x140x158 mm dimensions and comes without any fans. However, if there is a need to cool down CPUs with the TDP level higher than 80 W, the customer is free to enhance the facilities by adding two 120 mm fans. The latter are fixed to the heatsink by means of four brackets.



Zalman FX70 is an optimal choice for the following platforms: Intel LGA 2011/1366/115x/775 and AMD FM2/FM1/AM2/AM2+/AM3/AM3+. This cooler fits in any mid-tower ATX and larger PC chassis. The cooler’s framework consists of a copper base, pierced by six nickel-plated heatpipes, and of fifteen heatsink plates with an offbeat design, codenamed Twist; they are called to dramatically improve the process of heat management.


Fanless framework is regarded to be an advantage due to three reasons. First of all, pure heatsink provides absolutely no …