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알려져 장치: 165022367

마지막으로 알려진 드라이버 23.12.2020

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Top-Tier Chassis Zalman H1 Review

Zalman has long been deprived of a full-tower flagship PC chassis, after it discontinued the line of GS1200. The anticipation of a new etalon was accompanied by an overall market uncertainty as for the future of desktop platforms. Luckily, laptops and tablets couldn’t fully satisfy the customers’ growing needs, so Zalman decided to fire off with a new top-tier case, entitled H1. Stylish and magnetic from outside, this model has a lot of interesting options in the bins. Let’s have a look at them.



Key Features


Zalman H1 is a full-tower case, featuring 561x238x570 mm dimensions. The chassis is made of steel, aluminum and a high-quality plastic, with exterior and interior totally painted black. Internal layout allows for the installation of motherboards with elongated PCBs, including E-ATX and XL-ATX models. The model houses three external bays for 5.25-inch drives, seven internal bays for 2.5-/3.5-inch drives as well as nine expansion slots.


The case boasts some …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

The ASUS TUF X299 Mark 2 Motherboard Is Equipped With Long-Lived Electrical Assemblies and Aura Sync LED Backlighting

The novelty from ASUSTeK Computer – the TUF X299 Mark 2 motherboard – is based on the Intel LGA2066 socket and the X299 logic set. Manufactured in the ATX form factor, this card is equipped with long-life electrical assemblies.



ASUS TUF X299 Mark 2 features eight slots for the DDR4-4133 RAM (up to 128 GB capacity), three PCI Express 3.0 x16 interfaces, supporting multi-GPU configurations according to the x16/x16/x8 scheme (on top Skylake-X processors), a single PCI-E 3.0 x4 and a couple of PCI-E 3.0 x1. Drives can be linked via six SATA 6 Gbps ports and two M.2 (32 Gbps) connectors.


On the rear panel one can see four USB 2.0, four USB 3.1 Gen1, two USB 3.1 Gen2 ports, a PS/2 connector, a gigabit network RJ45 interface and a few audio jacks. The audio subsystem is built on the Realtek ALC S1220A audio codec. Like many other boards by this Taiwan vendor, TUF X299 Mark 2 ia supplied with the Aura Sync LED backlighting.


The ASUS TUF X299 Mark 2 motherboard costs around …

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DevID : : Gemplus