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Inajulikana kifaa: 165022367

Mwisho inayojulikana dereva: 23.12.2020

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The EK-FB MSI Z270 Gaming Monoblock RGB Water Unit Is Compatible With Low-Capacity Pumps

The Slovenian EK Water Blocks Company has produced the EK-FB MSI Z270 Gaming Monoblock RGB water unit, designed to serve with a range of Z270 chipset based MSI motherboards. Specifically, the list includes the MSI Z270 Tomahawk, MSI Z270 Tomahawk Arctic MSI Z270, Gaming Pro, MSI Z270 Gaming Pro Carbon, MSI Z270 SLI, MSI Z270 SLI Plus, as well as MSI Z270 Krait Gaming models.



The water block draws off heat from the LGA-1151 processor and from effective power subsystem voltage controllers. The device is supplied with a LED strip, optimized for a 4-pin connector on a system board or an external controller. This strip can be removed or replaced by a new one.


The nickel-plated water block base is made out of copper, and the transparent lid — out of acrylic plastic. The Low Hydrodynamic Resistance of the unit allows to utilize it with low-capacity pumps.


The approximate price of the specialty from EK Water Blocks is 120 EUR.

Arctic Cooling Announced the HEDT Platform Compatible Cooling Systems List

On the threshold of the new AMD HEDT platform (holding Ryzen Threadripper CPUs and Socket TR4 motherboards) release, the Swiss Arctic Cooling company published a list of cooling systems, compatible with a new socket.



As it turned out, despite a wide range of coolers available, only three models of maintenance-free water cooling systems will get the Socket TR4 platform support. Those are Liquid Freezer 360, Liquid Freezer 240 and Liquid Freezer 120. The first two of them can draw heat away from processors with TDP not higher than 300 W, and the third sample is able to chill 250 W CPUs.


By the way, the rated AMD Ryzen Threadripper chips thermal envelope is to get close to 180 W. Thus, only three above-mentioned Arctic Cooling water cooling systems can handle such a high TDP value. One should also note that these processing units are distinguished due to a large heat transfer cover surface, which specifies new requirements for the CPU coolers baseplates.

The First Glimpse on Motherboard Foxconn B75M

Foxconn has officially announced the release of a new motherboard B75M developed in microATX form-factor. The new product will be distinguished by an attractive price and available up-to-date kit of interfaces useful for home-based and corporate PCs. B75M will be compatible with Intel Ivy Bridge processors of the third generation (Core i3, i5, and i7). This motherboard employs only high-end components which prevent the system from malfunctions or interruptions: the integration of Japanese solid-state capacitors with the minimal error-free running time which achieves sixty thousand hours. Such approach is more vital for the systems that get used to work in 24/7 mode.



The integrated PCI-E 3.0 bus allows the installation of the most updated graphics adapter. SATA III port empowers the usage of speedy SSDs and HDD potential, while three USB 3.0 ports are destined to ensure the linkage with the external devices at maximal speed index. Motherboard Foxconn B75M is also furnished with …

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