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司机的名字 | Intel(R) H55 Express Chipset LPC Interface Controller - 3B06 |
文件名 | 52414_Chipset_Intel_WIN7_32_64_z9201015.zip |
供应商 | Intel |
驱动型 | SYSTEM |
尺寸 | 2.47 Mb |
版本 | 9.1.1.1022 |
驱动程序日期 | 2009-10-28 |
操作系统 | Windows 2000, Windows XP, Windows 2003, Windows Vista, Windows 7, Windows 8, Windows 8.1, Windows 10, Windows XP x64, Windows 2003 x64, Windows Vista x64, Windows 7 x64, Windows 8 x64, Windows 8.1 x64, Windows 10 x64 |
上传 | 2012-08-10 |
Or click to install driver manually | |
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Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.
New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.
Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …