HIS is glad to introduce one more high-end solution: the Radeon R9 280X IceQ Boost Clock graphics card that is targeting high-performance PC systems. The model employs turbine-type cooling system with a branded IceQ cooler. It consists of a voluminous copper base (35x28 mm), an aluminum heatsink, four nickel-plated heat-pipes (2x 8 mm and 2x 6 mm), as well as a single 80 mm turbine fan. Such cooling is ideal for multi-GPU configurations in AMD CrossFireX mode, since the distance between adapters does not influence the efficiency of their fans. 
Deepcool has introduced a ‘companion’ to its well-known cooler entitled Lucifer V2. The all-new Lucifer K2 features 163x146.5x131 mm dimensions and weighs 1047 g. The new-comer supports AMD and Intel platforms, including LGA2011-v3, LGA2011, LGA1366, LGA115x, LGA775 (Intel) & Socket FM2, FM2+, FM1, AM2, AM2+, AM3, AM3+ (AMD) as well as various CPUs with TDP level of not more than 130 W.| Intel(R) Display Audio | HDAUDIO\FUNC_01&VEN_8086&DEV_2805 |
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The Samsung Electronics company has announced the beginning of high-volume DDR4 (Double-Data-Rate-4) DRAM memory chips output. These microchips are aimed at a wide range of next generation computing systems. They are the most productive and energy-efficient DRAM chips of the 8 Gb capacity.It’s stated that the second gen (1y-nm) 10 nm technology is applied. While comparing it with the first generation methodology, one should note enhancement of key indicators. Thus, the running speed has increased by about 10 %, rate of information transfer is raised from 3,200 to 3,600 Mb/s. At the same time energy efficiency has grown by 15 %. Key specs improvement is achieved due to innovative technologies implementation (proprietary circuitry, for example).
It’s believed that such results will help Samsung accelerate the next generation (DDR5, HBM3, LPDDR5 and GDDR6 devices) memory chipsets market launch. The implementation area of these solutions …