In times of headlong production, trade and service development, medium- and large-scale companies have to lock horns with their competitors in order to win the targeted customer groups. The increase of client base and business expansion comes to the limelight on such conditions. The struggle with competitors gets more constructive shape due to the software business opportunities which information technology provides. Oracle corporation, which established solid reputation in software development market, has recently released a new version of business loyalty program entitled Siebel Loyalty Management 8.2.2. This program is targeted at companies that make business on retail sale and issuance of financial, travel and telecommunication services.



Improved functional characteristics of Siebel Loyalty Management 8.2.2 are supposed to be its major advantage. Those characteristics allow the companies not only to increase the clientele, but also to retain the market positions. The …

So now Asus is back with the new TUF Z270 Mark I: cool design, proper features and the most fan connectors ever seen. This motherboard’s design stays still familiar, dark, shielded and even more rugged, with camouflage elements. TUF Z270 is more optimized for cooling than its predecessor, its feature set is optimized for all the needs possible and its price is quite compatible, so your upgrade needs will be more budget friendly than ever before.


ASUS TUF Z270 Showcase

ASUS TUF Z270 Mark I Motherboard is designed for the 7th generation Intel processors for maximizing speed and connectivity with the Intel’s Optane Memory device. Its front USB 3.0 panel with currently rear USB 3.1 properly fast connections for both type A and C, as well as Intel Gigabit LAN connector gives almost endless possibilities. Still most, as it once again lacks its WIFI which is a real miss for most users.


The standard ATX 30.5 x 24.4 cm is followed by this model with the high-end ranges of …

Chassis of Full-Tower form-factor usually have solid framework due to the layout scheme and the necessity to enclose a lot of components. Developers from Lian Li company have totally demolished the current tendencies and announced the release of their PC-V750 Full-Tower model with the front-end PSU localization. This allowed the designers to dramatically decrement the size of the chassis without sacrificing its capacity and general specifications. The compact size of the chassis is considered to be a kind of ‘revolution’ in the market, since it is compatible not only with ATX and microATX motherboards, but also with Extended-ATX boards.



Lian Li PC-V750 casing is made of aluminum and approximates 7.35 kg in weight. Its dimensions provide for the installation of massive CPU-coolers (up to 170 mm in height), up to ten expansion cards, including 380 mm 3D cards. The chassis is equipped with five fans of 120 mm each: the two fans are located on the front plate, the other two – …