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Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of air across the base.

To continue, Cooler master promises to ensure practically noiseless work of their coolers due to the integration of vapor chamber to the base. The expediency of employment exactly this technological approach will much depend upon the final price index. Thus, all potential customers can only expect the sales start of CM V4 GT heatsink, the release of which is prognosticated for the third quarter of the current year.
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  • 02 August 2012, 18:04
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