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Thermalright Unveils a Colossal HR-22 CPU Heatsinks

Thermalright, a top-ranked Taiwanese developer of cooling solutions, has recently unveiled its newest CPU heatsink, entitled HR-22. The new-comer features 120x150x159 mm dimensions and is peculiar by nearly ‘colossal’ cooling effect. The HR-22 is targeting all up-dated platforms with Intel LGA2011/LGA1366/LGA115x and AMD FM1/FM2/AM3/AM3+ sockets. The company promises to start the sales in the nearest future, though pricing is still unknown.

Thermalright HR-22 boasts a tower-like framework, consisting of a copper base, thirty-five aluminum plates, and eight nickel-plated heatpipes (6 mm each). The only hexagonal notch in the center is thought to simplify the heatsink installation.

All the plates contain rectangular holes that facilitate the airflow when used in passive mode. Such peculiarity is called Direct Passive Airflow System (DPAS). It not only provides for an efficient cooling and unimpeded airflow, it saves the users’ ears from noise: a powerful heatsink is able to cope with heat at 0 dB noise. Here’re some basic features pertained to DPAS technology:

— promotes for 40% larger heat dissipation area, if compared with the preceding models;
— provides no interference with RAM modules, PCI Express slots or full-format motherboards, due to axis displacement;
— ensures enhanced and more oriented airflow;
— ensures some 10%-15% increase in performance, thanks to a proprietary airflow tunnel.
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  • 29 October 2013, 18:41
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