Thermalright Inc. has managed to design and supply a whole galaxy of cooling solutions for the entire period of its existence. The prototype of the cooler codenamed Thermalright Archon SB-E was announced last spring and its original version has reached the market this autumn. This model is characterized by some outstanding efficiency and noise level showings, as well as high compatibility with diverse platforms.



General Peculiarities


This air cooler is delivered in a traditional for this manufacturer cardbox. The box contains the cooler itself and a set of key components, featuring a universal backplate, a set of screws, a screwer, fan frames, and brand thermal compound — Thermalright The ChillFactor III. Archon SB-E features 175x155x79.5 mm dimensions and weighs 940 g. It is compatible with Intel and AMD platforms and supports sockets LGA 775/1155/1156/1366/2011 (Intel) and 939/FM1/FM2/AM2/AM2+/AM3/AM3+ (AMD).


Framework


The implemented heatsink accommodates …

Global laptop shipments have faced with glut stocks in March and a weakening global economy in May. That caused the situation of reaching a growth of supply in the second quarter of the year only for 5% compared with the previous, and it fell by 1.8% compared with this period year ago. Shipments totalled just over 50 million units, according to analysts.



Numbers of Acer and Lenovo laptop shipments were at the average level on the world market in comparison the first quarter of the year. Shipments of mobile PCs from HP, Dell and Toshiba have fallen to 4-7%. Most of all with the increase of supply by 36% managed its shipment the ASUS Company.


It is interesting that HP may soon lose its title of leader in the laptop market — China's Lenovo breathes down its neck, lagging behind only with 500,000 units. ASUS surpassed Dell, becoming the fourth largest producer of mobile PCs in the world with a share of 11.3%, and Apple and Samsung are in the seventh and eighth places …

Zalman has officially launched a new liquid cooling system, Reserator 3 Max Dual, firstly introduced at CES 2014. It is peculiar by the support of all up-to-date CPU sockets for AMD and Intel platforms, as well as by outstanding performance. With the aim to enhance heat dissipation effect, the company supplements the model with a proprietary Zalman ZM-STG2M thermal grease.



Zalman Reserator 3 Max Dual consists of a waterblock with a copper base, two connecting hoses, two heatsinks, and a pair of 120 mm fans. The base of the waterblock boasts an improved framework; it has got a flanged coating that promotes for the acceleration of heat dissipation. Both heatsink sections are nickel-plated. The heatpipes implemented within their framework resemble a maze; this allows liquid to employ the maximal dispersion area.


The incorporated 120 mm fans are equipped with a long life bearing and a bright blue LED. Their operation is adjusted by means of PWM technology, so the rotational …