Intel has officially introduced its new motherboard codenamed DX79SR. According to the company's developers, this board is the most functional one among all models ever released by Intel. One won't find it difficult to guess that the release of DX79SR is devoted to the announcement of a flagship processor Intel Core i7-3970X EE which breaks all records in terms of power-efficiency: its TDP level is estimated at 150W. 
Deepcool Industries comes out with the second revision of Assassin CPU cooler. The GamerStorm Assassin II is a dual-fan solution intended for hard-core users with thirst for utmost performance and noiseless operation. The model is compatible with most of AMD and Intel platforms, including AM2/AM2+/AM3/AM3+/FM1/FM2/FM2+ & LGA 775/1150/1155/1156/1366/2011/2011-v3. 
Scythe has recently amazed the community by the introduction of absolutely transparent chassis. ACB-Type3 model preserves the cutout of the standard Mid-Tower chassis solutions, but is made of transparent acrylic plates. One more peculiarity of this model is the parallel to the base localization of motherboard. Besides, ACB-Type3 is compatible with motherboards of various form-factor, including mini-ITX, micro-ATX, and ATX.
HUAWEI Mobile CMCC MMS
USBCDCACM\VID_12D1&PID_1444&MI_02
HUAWEI Mobile CMCC Modem
USBCDCACM\VID_12D1&PID_1445&MI_02
HUAWEI Mobile Connect - 3G Modem
USBCDCACM\VID_12D1&PID_144E&MI_02
HUAWEI Mobile Connect - Modem
USBCDCACM\VID_12D1&PID_144F&MI_02
Vodafone Mobile Broadband Modem (Huawei)
USBCDCACM\VID_12D1&PID_14A5&MI_00
USBCDCACM\VID_12D1&PID_1444&MI_02
HUAWEI Mobile CMCC Modem
USBCDCACM\VID_12D1&PID_1445&MI_02
HUAWEI Mobile Connect - 3G Modem
USBCDCACM\VID_12D1&PID_144E&MI_02
HUAWEI Mobile Connect - Modem
USBCDCACM\VID_12D1&PID_144F&MI_02
Vodafone Mobile Broadband Modem (Huawei)
USBCDCACM\VID_12D1&PID_14A5&MI_00