Gigabyte Technology introduces three new motherboards of micro-ATX form-factor, based on Intel H81 Express chipset. The new-comers, entitled GA-H81M-DS2, GA-H81M-D3V and GA-H81M-D2V, are equipped with LGA1150 socket that supports Intel Haswell CPUs. Their efficiency and durability is the result of the implementation of Gigabyte Ultra Durable 4 Plus concept, On/Off Charge and UEFI DualBIOS technologies, as well as of prime capacitors with a solid electrolyte. Each motherboard is unique, so the specifications of each item are worth of being detailed. 
Right after the recent release of laptop series, Dell announced the release of a new monitor, codenamed U2712HM. Moreover, this model can be already found in the Japanese market and costs approximately $635. The major peculiarity and attraction for the potential consumers is the implementation of AH-IPS array type in the development of the monitor. AH-IPS promotes for the overall improvement of color rendering and enlargement of viewing angles to 178 degrees (horizontal and vertical). | HAMA PC-WEBCAM AC-120 | USB\VID_17A1&PID_0118 |
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Thermalright decided to gladden all devotees of ultra-quiet PC systems by designing an efficient passive cooler – Le Grand Macho. This is a conventional tower cooler, supporting new and outdated CPUs of up to 95 W TDP. Hence, the greenhorn is compatible with Intel LGA 775/115x/1366/2011/2011-3 as well as AMD FM2/FM2+/FM1/AM2/AM2+/AM3/AM3+ platforms.Initially, Thermalright Le Grand Macho is void of any fan; nonetheless, its framework presupposes the installation of one or two high-efficiency fans (120/140 mm), which are able to cope with 300-watt CPUs.
The cooler consists of a nickel-plated base, seven heatpipes and a voluminous aluminum heatsink with 35 fins. The latter come with perforations which counteract air between the plates with low air resistance. The base features a convex-shaped contact surface (that optimizes cooling efficiency) and is perfectly polished. Seven 6-mm heatpipes are solidly integrated into the base, ensuring ideal heat dissipation.
The …