Corsair, an American supplier of RAM memory and SSD solutions, is mapping out the forthcoming release of three new DDR3 memory kits. All three kits will be delivered within the confines of Dominator Platinum series: CMD8GX3M2A2400C10, CMD32GX3M4A2400C10 and CMD32GX3M4A1866C9 models. The kits will be delivered with a lifetime warranty.



Memory modules, included in these kits, are equipped with DHX aluminum heatsinks and improved cooling technology, feature 56 mm height, and support Intel XMP overclocking profiles. Their optimal operational frequency is estimated at 1866 MHz and 2400 MHz.


Corsair CMD8GX3M2A2400C10 kit consists of two 4GB DDR3 modules (8GB overall capacity) and feature 1.65V nominal voltage index. The timings for the kit are shown as 10-12-12-31. Its framework accommodates white LED bar.


Four-channel Corsair CMD32GX3M4A2400C10 kit operates at 2400 MHz frequency. Its overall capacity equals to 32GB, while all other specifications are similar to the 8GB …

LG smartphones developed on Windows Phone platform didn’t live up to the corporate management and developers’ expectations. The sales volume of such devices leaves much to be desired. In contrast to such statistics, LG smartphones developed on Android platform enjoyed wide popularity among huge customer audience.


In view of such conditions, LG management team has taken a decision to call a halt to the production of devices on Windows Phone and produce devices on Android by leaps and bounds. Such statement has been made by the corporate representatives during the official meeting dedicated to the announcement of data on sales volume for the previous quarter.



LG smartphone developers and sales department team confirm that the level of sales of devices produced on Windows Phone was inconsiderable as compared to the level of sales of devices on Android. It is believed that smartphones on Android contributed great mite to the improvement of the overall company’s …

Thermalright Inc. has managed to design and supply a whole galaxy of cooling solutions for the entire period of its existence. The prototype of the cooler codenamed Thermalright Archon SB-E was announced last spring and its original version has reached the market this autumn. This model is characterized by some outstanding efficiency and noise level showings, as well as high compatibility with diverse platforms.



General Peculiarities


This air cooler is delivered in a traditional for this manufacturer cardbox. The box contains the cooler itself and a set of key components, featuring a universal backplate, a set of screws, a screwer, fan frames, and brand thermal compound — Thermalright The ChillFactor III. Archon SB-E features 175x155x79.5 mm dimensions and weighs 940 g. It is compatible with Intel and AMD platforms and supports sockets LGA 775/1155/1156/1366/2011 (Intel) and 939/FM1/FM2/AM2/AM2+/AM3/AM3+ (AMD).


Framework


The implemented heatsink accommodates …