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Driver name | DW5811e Snapdragon(TM) X7 LTE |
File name | 491091_DW5811e-Customer-Kit-Module-Qualcomm-Snapdragon-X7_J17G6_WIN_7.60.4835.501_A07.EXE |
Vendor | Sierra Wireless Incorporated |
Driver type | NET |
Size | 326 Mb |
Version | 18.4.1050.98 |
Driver Date | 2018-04-12 |
Operating system | |
Upload | 2020-12-11 |
Or click to install driver manually | |
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The LEPA NEOllusion cooling system features the base, four 6 mm copper heat pipes with a direct contact to the CPU heat dissipation lid, the aluminum radiator and the 120 mm fan (its rotative speed range is 600–1800 rpm or 400–1000 rpm with a set adapter). With the special blades shape and excellent aerodynamic qualities it can pump the air flow of up to 128.12 m3/hr (up to 78.31 m3/hr with an adapter) at the static pressure of 2.41 mm H2O (0.9 mm H2O) and the noise grade of 33 dBA (19 dBA).
LEPA NEOllusion dimensions are 161.7 х 126 х 40 mm, and its weight is 645 g. It is compatible with …